In the A-share market, the concept of Huawei has an upcoming appeal. For example, Huawei announced the patent of "chip packaging". In the field of advanced packaging, Wen Yi Science and Technology doubled its market value in just 65,438+0 months. At the same time, leading enterprises such as powerful new materials and three super new materials were born.
Diamonds are what we often say. "Diamonds last forever, and one lasts forever", and diamonds are regarded as the witness of love. But many people don't know that diamonds are also excellent semiconductor materials. Diamond has the advantages of large size, low impurity concentration and high crystallization quality, and is expected to become the fourth generation semiconductor material.
Compared with previous generations of semiconductor materials such as silicon (Si), germanium (Ge), gallium arsenide (GaAs), indium phosphide (InP), gallium nitride (GaN) and silicon carbide (SiC), diamond has more obvious advantages. Diamond chips have excellent mechanical, electrical, thermal, acoustic, optical and corrosion resistance properties, and have broad application prospects in high-tech fields.
Development trend of industrial technology
At present, diamond wire is mainly used in the production of single crystal silicon wafer cutting, and its demand accounts for more than 90%. The demand trend of photovoltaic industry basically determines the development trend of diamond wire.
In the production cost of silicon wafer, the cost of silicon material accounts for about 84%, and the cost of diamond wire accounts for about 1%. The quality of silicon wafer production is mainly affected by diamond wire cutting, followed by cutting equipment. If the cutting quality of silicon wafer is not good, it will bring greater loss of silicon material to customers.
In recent years, the downstream silicon wafer industry has developed in the direction of "large size+thinning". With the evolution of wafer slicing, the groove pitch of cutting equipment is correspondingly reduced, and the pitch of diamond wire saw wound on the groove pitch is also reduced, and the liquid carrying capacity of wire saw is further weakened.
When diamond wire cutting large-size monocrystalline silicon rod, the transverse and longitudinal cutting lengths increase, which increases the single-line load, and the swing of the cutting line is small, which also restricts the parameter design of diamond wire.
Reference to the above content: Baidu Encyclopedia-Huawei Technology Co., Ltd.