Description of responsibilities: 1. Organize the introduction of new materials into the BOM materials of special display (vehicle, industrial control) products;
2. Regularly organize new material introduction meetings to confirm the necessity of new material introduction, new material level, and regularly summarize and update the new material verification progress and new material usage rate;
3. Cooperate with resources and market demand, develop effective New materials for competitive advantage.
4. Regularly collect the material requirements from the roadmap of the Advanced Technology Research Institute, the Frontier Technology Integration Department and the Product Department, organize discussions and output the material roadmap;
5. Responsible for organizing and sorting out the roadmap Solve the problem of unclear technical test specifications of materials (on-vehicle and industrial control) and identify new material technology risks (including patent risks).
FPC is the abbreviation of Flexible Printed Circuit, also known as flexible circuit board, flexible printed circuit board, flexible circuit board, referred to as soft board or FPC, which has the characteristics of high wiring density, light weight and thin thickness.
Mainly used in many products such as mobile phones, notebook computers, PDAs, digital cameras, LCMs, etc.
FPC flexible printed circuits are based on polyimide or polyester film A highly reliable, excellent flexible printed circuit made of high-quality materials.
Product features:
1. It can be bent, folded and rolled freely, and can move and expand at will in three-dimensional space.
2. Good heat dissipation performance, F-PC can be used to reduce the size.
3. Achieve lightweight, miniaturization, and thinness, thereby achieving integration of component devices and wire connections.
FPC application fields
MP3, MP4 players, portable CD players, home VCDs, DVDs, digital cameras, mobile phones and mobile phone batteries, medical, automotive and aerospace fields
FPC has become an important type of epoxy copper-clad laminate
Flexible copper-clad laminate (FPC) with flexible functions and based on epoxy resin is becoming more and more widely used due to its special functions , is becoming an important variety of epoxy resin-based copper clad laminates. However, our country started late and needs to catch up.
Epoxy flexible printed circuit board has experienced more than 30 years of development since its industrial production. Real industrialized production began in the 1970s. Until the late 1980s, due to the advent and application of a new type of polyimide film material, flexible printed circuit boards made FPC an adhesive-free type. FPC (generally referred to as "two-layer FPC"). In the 1990s, photosensitive covering films corresponding to high-density circuits were developed around the world, which led to a major change in FPC design. Due to the opening up of new application fields, the concept of its product form has undergone considerable changes, including expanding it to a wider range including TAB and COB substrates. The high-density FPC that emerged in the second half of the 1990s began to enter large-scale industrial production. Its circuit graphics are rapidly developing to a more fine level, and the market demand for high-density FPC is also growing rapidly.
FPC can also be called: flexible circuit board
PCB is called hard board
The most common materials are:
U.S. Capital: DuPont ROGERS Japanese capital: Arisawa TORAY Shinetsu Kyocera