Buy an e-book or search online. There will be a lot of information.
You're not in electronics. You can learn PROTEL software. There are many company component libraries in it.
There are many packages. Look at them one by one.
Generally speaking, components are inserted and installed.
1. ball grid array package
2.CSP chip scaling package
3. Install Cob chip on the board
4. The chip is installed in 4. COC ceramic substrate
5.MCM multi-chip model installation
6.LCC leadless chip carrier
7.CFP ceramic flat package
8.PQFP plastic four-pin package
9.SOJ plastic J-wire package
10.SOP small package
1 1.TQFP flat square packaging
12.TSOP miniature thin chip package
13.CBGA ceramic solder ball array package
Cpga ceramic pin grid array package
15.CQFP ceramic square pins are flat.
16.Cerdip ceramic fusion sealing double row
17.PBGA plastic solder ball array package
18.SSOP small plastic package with narrow spacing
19.WLCSP wafer level chip scale package
20. Flip chip on FCoB board
Learn eight slowly.
Part packaging refers to the appearance and solder joint position indicated when the actual part is soldered to the circuit board. It is a pure concept of space. Therefore, different components can be packaged with the same component, and the same component can also be packaged with different components. Like resistors, there are traditional pin-type components, which are bulky and must be drilled on the circuit board to place components. After drilling, it is expensive to insert the parts into the tin furnace or spray tin (or weld them by hand). Newer designs use small surface mount components (SMD) without drilling holes. Pour the semi-melted solder paste into the circuit board with strip steel film, and then put the SMD component on the circuit board, and it can be soldered.
Axial resistance
Electrodeless capacitance RAD
Electrolytic capacitance RB-
Potentiometer VR
Diode diode
Triode to
Power regulator modules 78 and 79 series to-126h and to-126V.
FET is the same as triode.
Rectifier bridge d-44 d-37 d-46
CON SIP single row multi-pin socket
Dual in-line element
Crystal vibration XTAL 1
Resistance: RES 1, RES2, RES3, RES4；; The nature of packaging is axial series.
Non-polar capacitance: cap package attributes are RAD-0. 1 to rad-0.4.
Electrolytic capacitance: the package properties of electroi are rb.2/.4 to rb.5/ 1.0.
Potentiometer: pot 1, pot 2; The encapsulation properties are vr- 1 to vr-5.
Diode: The package property is diode -0.4 (low power) diode -0.7 (high power).
Triode: The common packaging property is to- 18 (common triode) to-22 (high-power triode) to-3 (high-power darling).
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There are 78 and 79 series of power regulator blocks; Series 78, such as 7805, 78 12, 7820, etc.
Series 79 includes 7905, 79 12, 7920, etc.
Common encapsulation attributes are to 126h and to 126v.
Rectifier bridge: BRIDGE 1, BRIDGE2: The package property is D series (D-44, D-37, D-46).
Resistance: AXIAL0.3-AXIAL0.7, where 0.4-0.7 refers to the length of resistance, and AXIAL0.4 is generally used.
Capacitance of ceramic tile: RAD0. 1-RAD0.3, where 0. 1-0.3 is the capacitance, and RAD0. 1 is generally adopted.
Electrolytic capacitance: Rb.1.2-Rb.4/.8, where.1.2-.4/.8 refers to capacitance. RB.3/.6 is generally used for 470 UF.
Diode: DIODE0.4-DIODE0.7, where 0.4-0.7 refers to the length of the diode, generally using DIODE0.4.
Light emitting diode: RB. 1/.2
Manifold block: DIP8-DIP40, where 8-40 refers to how many feet there are, and 8 feet is DIP8.
Smd resistor
0603 indicates that the package size is independent of the specific resistance.
But the package size is related to power. Generally speaking,
020 1 1/20W
0402 1/ 16W
0603 1/ 10W
0805 1/8W
1206 1 4W
The corresponding relationship between the external dimensions of the capacitor and the package is:
0402= 1.0x0.5
0603= 1.6x0.8
0805=2.0x 1.2
1206=3.2x 1.6
12 10=3.2x2.5
18 12=4.5x3.2
2225=5.6x6.5
We have discussed device packaging before, except device packaging. In addition to the components in the LIB library, the components in other libraries already exist.
Fixed component packaging, this is because there are many forms of components in this library: take transistors as an example to illustrate:
Transistor is one of the commonly used components in devices. In the LIB library, there are only NPN and PNP, but
In fact, if it is 2N3055 of NPN, it may be to-3 of iron shell, and if it is 2N3054 of NPN, there is.
It may be TO-66 or TO-5 in the iron shell, while CS90 13 used for research includes TO-92A, TO-92B, TO-5, TO-46 and TO-5.
And so on, ever-changing.
There is also a resistor. In the device library, it simply calls them RES 1 and RES2, regardless of whether it is100Ω or not.
It doesn't matter whether it's 470 kω or not. For the circuit board, it has nothing to do with the ohm number, but depends entirely on the power of the resistor.
We choose 1/4W or even 1/2W resistor, which can be packaged with AXIAL0.3 components, if the power is higher.
, AXIAL0.4, AXIAL0.5, etc. Now commonly used component packages are arranged as follows:
Resistor and nonpolar double-ended element axis 0.3- axis 1.0
Nonpolar capacitance RAD0. 1-RAD0.4
Polar capacitance RB.2/.4-RB.5/ 1.0
Diode 0.4 and diode 0.7
Quartz crystal oscillator XTAL 1
Transistor, field effect transistor, UJT to XXX (to -3, to -5)
Variable resistor (POT 1, POT2) VR 1-VR5
Of course, we can also open the library C: \ client98 \ pcb98 \ library \ advpcb.lib to find the corresponding seal of the parts used.
Pretend.
You'd better recite these commonly used component packages. You can divide these component packages into two parts.
Everyone should remember that the resistance AXIAL0.3 can be divided into axial and 0.3, which means axial when translated into Chinese, and 0.3 means printed resistance.
The pad spacing on the printed circuit board is also 300mil (because in the field of motors, it is mainly in English units. identical
Yes, RAD0. 1-RAD0.4 is the same for nonpolar capacitors; For polar capacitors, such as electrolytic capacitors, the package is R.
B.2/.4, regular budget 3/.6, etc. , where ".2" is the pad pitch and ".4" is the outer diameter of the capacitor cylinder.
For transistors, look directly at the shape and power. For the high power transistor, the power transistor in to-3 is used.
If it is flat, use TO-220, if it is a metal case, use TO-66, and use TO-5 for low-power transistors.
, TO-46, TO-92A, etc. Anyway, its stitches are long, and it is ok to bend it.
Commonly used integrated IC circuits, including DIPxx, are packages of dual in-line components, and DIP8 is double-lined, with 4 leads in each row.
Foot, the spacing between two rows is 300mil, and the spacing between pads is 100mil. SIPxx is a single-row package. Wait a minute.
Pay attention to transistors and variable resistors, and their packaging is the biggest headache. Same package, same pin.
Not necessarily the same. For example, for a package like TO-92B, pin 1 is usually E (emitter), while pin 2 may be.
B pole (base), or C pole (collector); Similarly, the three feet may be C or B, especially which one.
We can't be sure until we get the component. Therefore, the circuit software dare not define the pad name (pin name) rigidly. Similarly,
Field effect transistors and MOS transistors can also be packaged like transistors and can be used for three-pin components.
Q 1-B, in PCB, when loading this network table, the node will not be found (mismatch).
Similar problems will also occur in variable resistors; In the schematic diagram, the pins of the variable resistor are 1, w and 2 respectively.
The generated network tables are 1, 2 and w, and in the PCB board, the pads are 1, 2, 3. When these two elements are present in the circuit
The fastest way to modify the difference between PCB and SCH is to create a network table and insert the crystal oscillator directly into the network table.
The body tube pin is changed to 1, 2, 3; Just change the variable resistor to 1, 2, 3, which is the same as the circuit board component.