Huidie Automation Technology Co., Ltd. has successfully developed a patented product, fully automatic plasma nano-polishing equipment. Plasma nano-polishing is a brand-new metal surface treatment process-only the molecular layer on the workpiece surface reacts with plasma, the general distance between atoms in the molecule is 0. 1-0.3 nm, and the treatment depth is 0.3- 1.5 nm. The surface roughness of the polished object is in the range of 65438±0mm, so plasma nano-polishing treatment can chemically activate the surface of the workpiece, remove the surface molecular pollution layer and cross-link the surface chemicals. Huidie Company further developed the formula of nano polishing solution, which further reduced the cost of polishing solution and further optimized the polishing effect.
Principle of plasma polishing
Plasma, also known as the fourth state of matter, is an electromagnetic gas discharge phenomenon, which partially ionizes gas particles, including atoms, molecules, atomic groups, ions and electrons. Plasma is that the polishing agent is dissolved in water at high temperature and high pressure. At high temperature and high pressure, electrons will escape from the nucleus, and the nucleus will form a positively charged ion. When these ions reach a certain amount, they can become plasma with great energy. When these plasmas rub the object to be polished, the surface of the object will brighten in an instant.