Do adhesives belong to electronic accessories? What are the specific classifications?

Including various insulating materials, shielding, EMI materials, shock-proof products, heat-resistant and heat-insulating materials, adhesive products, dust-proof materials, sponge products and other special materials, which are suitable for manufacturers of electronics, electrical appliances, toys, lighting, telecommunications, machinery and so on. Therefore, adhesive bonding also belongs to the category of electronic accessories, which is mainly used for bonding and packaging electronic components. Electronic glue can be mainly divided into: 1, SMT/SMD/SMC electronic glue-patch red glue. Low-temperature curing adhesive SMT series patch adhesive belongs to epoxy resin (rapid thermal hardening) adhesive, some of which have high shear dilution viscosity characteristics, and is suitable for high-speed surface patch assembly machine (barrel type) dispensing machine, especially for various ultra-high-speed dispensing machines (such as HDF). Some models have viscosity characteristics and flexibility, which are especially suitable for the offset printing process of steel mesh/copper mesh, and can obtain good molding and effectively prevent PCB from overflowing. According to the requirements of pollution-free products, the products are designed and developed into lead-free (lead-free) welding products that require high temperature resistance. Low temperature curing adhesive is an improved epoxy resin adhesive with one component and low temperature curing. This product is used for low-temperature curing and can form the best adhesion between various materials in a very short time. The product has excellent working performance and high storage stability, and is suitable for memory cards, CCD/CMOS and other devices. It is especially suitable for heat-sensitive elements that need low-temperature curing. 2.COB/COG/COF electronic adhesive-cofferdam filling adhesive, COB bonded vinyl cofferdam filling adhesive series one-component epoxy adhesive, suitable for ic packaging of epoxy glass substrates, such as battery circuit protection boards and other products. The product has excellent welding resistance and moisture resistance, low thermal expansion coefficient to reduce deformation, excellent temperature cycling performance and good fluidity. COB bonded vinyl is a one-component epoxy resin adhesive, which is the best supporting product for IC bonding. Specially used for flexible packaging of IC electronic crystals, suitable for various electronic products, such as calculators, PDA, LCD, meters and so on. It is characterized by high fluidity, easy dispensing and low glue point height. After curing, it has the characteristics of flame retardant, bending resistance, low shrinkage and low moisture absorption, which can provide effective protection for IC. The design of this encapsulant is a high-quality product developed after long-term temperature/humidity/power-on test and thermal cycle. 3.BGA/CSP/WLP electronic adhesive-underfill adhesive is a kind of adhesive used for CSP & amp； BGA underfill technology. It can form a consistent and defect-free underfill layer, and can effectively reduce the overall temperature expansion characteristic mismatch between the silicon wafer and the substrate or the impact caused by external force. The lower viscosity makes it more suitable for bottom filling; High fluidity enhances the operability of its repair. 4.MC/CA/LE/EP packaging material-conductive silver glue conductive silver glue is a one-component epoxy conductive adhesive with silver powder as the medium. It has the characteristics of high purity, high conductivity, low modulus and long working time. These products have excellent storage stability at room temperature, low curing temperature and low ion impurity content, and the cured products have good electromechanical properties and thermal stability. The products have been successfully applied to the conductive bonding of LED, LCD, quartz resonator, chip tantalum capacitor, VFD, ic and so on. And is suitable for printing or distribution process. 5. Special silicone electronic packaging materials-Special silicone potting/adhesive materials Silicone adhesives are used in many assembly processes. Silicone is widely used in solar energy, lighting equipment, household appliances and other assembly industries because of its weather resistance, ultraviolet aging resistance and high temperature resistance. If necessary, please contact me in Shenzhen.