Texturing refers to removing the mechanical damage layer and texturing the surface of silicon wafer: for example, single crystal pyramids and polycrystalline pits, which are simply made uneven, so that sunlight can be reflected many times and light absorption can be enhanced!
Generally speaking, the next texturing process is called diffusion: it is to form PN nodes on the silicon wafer, which is the core of the battery. However, in the process of making PN junction, PN junction will also occur at the edge of silicon wafer, which will lead to short circuit between the two poles of the battery. Therefore, to completely remove the PN junction generated at the edge, this process is called etching!
Etching: divided into dry method and wet method. The dry method is to stack all silicon wafers together and etch the PN segment around the silicon wafers by plasma gas.
Wet etching is etching the whole back with acid and alkali! ! !