In June 2009, 5438+065438+1October 10, Huatian Science and Technology's "Copper Bonding and Packaging Technology for Integrated Circuits" passed the appraisal of scientific and technological achievements of Gansu Science and Technology Department, and the achievements reached the international advanced level. At the same time, Huatian Technology's five scientific and technological achievements, such as "Research and Development of Small Carrier Four-sided Flat Leadless Integrated Circuit Packaging Technology", "Research and Development of Double-row Lead Four-sided Flat Leadless Packaging Technology", "Research and Development of Film and Chip Packaging Technology", "TO252-3L(B) High Reliability Power Supply Packaging Technology" and "Research and Development of HSIP High Power Device Packaging Technology", have also passed the scientific and technological achievements appraisal of Gansu Provincial Science and Technology Department, and these five scientific and technological achievements have all reached the domestic level.
From June, 5438 to February, 2008, Xiao Shengli, the chairman of Tianshui Huatian Technology Co., Ltd., won the 2008 China Information Industry Economic Person of the Year.
On July 8, 2008, Jia Qinglin, Chairman of CPC The Politburo Standing Committee (PSC) and Chinese People's Political Consultative Conference, and Du Qinglin, Vice Chairman of Chinese People's Political Consultative Conference and Director of the United Front Work Department of the Central Committee, visited China.
On April 29th, 2008, the foundation stone was laid for Huatian Science and Technology Building with a building area of 23,989 square meters.
In 2007, 2.775 billion pieces of integrated circuits were packaged, with a sales income of 682.08 million yuan and a profit of 966.5438+million yuan, a substantial year-on-year increase.
On June 22, 2007, Huatian Science and Technology completed the projects of "TSSOP Series Ultra-thin Micro-packaging Technology", "IC Packaging Anti-dense Layer Technology" and "LIP IC Packaging Technology", and passed the appraisal of scientific and technological achievements by the expert committee of the Provincial Science and Technology Department.
In 2007, the copper wire process passed the verification.
On October 20, 2007165438+/kloc-0, the company's stock was successfully listed on the A-share of Shenzhen Stock Exchange, becoming the sixth listed company in domestic microelectronics industry and the first listed company in Tianshui.
On July 8, 2007, 10 and 12, the interactive exchange meeting of corporate culture of huatian group was held in the conference room on the seventh floor of huatian apartment.
On May 28th, 2007, Huatian Science and Technology IC High-end Packaging Industrialization Project held an international competitive bidding meeting.
In 2007, Huatian Technology PQFP 100L( 1420)3D packaging technology won the first prize of Tianshui Science and Technology Progress Award.
In 2007, the "PQFP 100LIC Stacked (3D) Integrated Circuit Plastic Packaging Technology" independently developed by Huatian Technology passed the appraisal of provincial scientific and technological achievements.
On February 26th, 2006, the first third workers' congress of Tianshui Huatian Technology Co., Ltd. was held in the conference room on the sixth floor of Huatian Apartment.
In 20051October 28th, 165438, the technology company passed the environmental management system certification of classification society.
On February 17, 2005, the No.9 new workshop of Huatian Science and Technology Company with a total construction area of 8,625 square meters was put into use, and the second manufacturing department was put into operation.
On March 28th, 2004, Tianshui Huatian Technology Co., Ltd. held a grand opening ceremony.
On June 5438+February 25, 2003, Tianshui Huatian Technology Co., Ltd. was formally incorporated.