In the manufacturing process of the chip, an oxide layer is grown on the surface of the silicon wafer by oxidation, and the silicon substrate is diffused and doped by engraving and etching on the oxide layer, thus activating the semiconductor properties of the silicon wafer, thus forming an effective PN junction.
second, lithography equipment
the essence of lithography is to copy the circuit structure diagram to the photoresist on the silicon wafer, which is convenient for etching and ion implantation afterwards. Since the birth of integrated circuits, lithography has been regarded as the driving force for the development of integrated circuit manufacturing technology.
iii. gumming and developing equipment
gumming and developing equipment is gumming, baking and developing equipment matched with mask aligner in the photolithography process, including gumming machine, gumming machine and developing machine. This equipment not only directly affects the formation of fine exposure patterns in lithography process, but also has a profound impact on the results of pattern transfer in subsequent etching and ion implantation processes.
iv. etching equipment
etching refers to the step of selectively removing the part of the silicon wafer that is not masked by photoresist, thereby transferring the predefined pattern to the material layer of the silicon wafer.
V. Ion implantation equipment
Generally speaking, the conductivity of intrinsic silicon (that is, the original silicon single crystal without impurities) is very poor. Only when a small amount of impurities are added to silicon to change its structure and conductivity, silicon becomes a truly useful semiconductor.
VI. Thin film deposition equipment
1, PVD equipment
2, CVD equipment
VII. CMP equipment
CMP (chemical mechanical polishing) process means that the polishing head of the polishing machine holds the silicon wafer to move at a high speed relative to the polishing pad, and the polishing liquid continuously flows between the silicon wafer and the polishing point, and the oxidant in the polishing liquid continuously contacts the exposed surface of the silicon wafer to produce an oxide film, and then the particles in the polishing liquid are mechanically used.
VIII. Testing equipment
1. Quality measuring equipment
2. Electrical testing equipment
9. Cleaning equipment.