1. In a broad sense, electroplating additives include a wide range of additives, anti-rust agents, anti-mildew agents, sealants, anti-discoloration agents, etc. In a narrow sense, they refer to additives, such as brighteners Agents, wetting agents, softeners, positioning agents, etc. The positioning agent is an additive that enables the low potential area to be plated better. It should generally be used in conjunction with other brighteners. It can be added alone, but it should not be used alone.
2. Mainly include galvanizing, copper plating, nickel plating, chromium plating, iron plating, tin plating, lead plating, precious metal plating (gold, silver, palladium, rhodium, platinum, etc.), and various alloy plating etc. Electroplated silver copper alloy is mainly used for electrical contact plating. It has fine crystallization, low brittleness, and its wear resistance is better than pure silver.
3. It is difficult to plate nickel evenly on large plates. The periphery is thicker and brighter, and the middle is thinner and darker. The concept of "dispersion ability" is used to explain this phenomenon in electroplating. In order to plate as uniformly as possible, in addition to strengthening stirring, using positioning agents, increasing the distance between electrodes and other measures, it is mainly necessary to use auxiliary anodes.
4. There are many ways to recover gold. Here is one method: under ventilation conditions, use hydrochloric acid to adjust the pH to about 1, heat to 70-80°C, add zinc powder while stirring, until The solution is transparent and slightly yellow, with gold powder precipitating. Filter it. The gold powder is first boiled with hydrochloric acid and then nitric acid, washed several times with pure water, and dried.
5. After gold plating, clean it thoroughly with pure water and dry it in time. Generally, there will be no water stains, let alone oil stains.
6. The following three points should be noted for electroplating quality control: (1). Establish and effectively implement a modern quality management system and rules and regulations, clarify responsibilities, and check at all levels; (2). Timely analyze and adjust the solution ingredients to ensure that the solution is normal; (3). Strictly operate in accordance with the process regulations.
7. Kovar material is i.e. Kovar alloy, consisting of: Ni29%, Co17%, Fe54%. It is used for sealing electronic components and glass ceramic devices.
8. Electroless nickel plating is the most widely used electroless plating process. Sodium hypophosphite is often used as a reducing agent. The resulting coating is actually a nickel-phosphorus alloy. It is not only used for non-metal electroplating of metals. Chemical treatment, also used for functional coatings, such as corrosion-resistant and wear-resistant coatings. Chemical silver plating was used in the past to make mirrors and thermos bottles, but now it is mostly used for parts with complex shapes that require high reflectivity. The coating layer is very thin, the stability of the plating solution is poor, and it can usually only be used once, and the cost is high. The chemical gold plating layer has good chemical stability, corrosion resistance, conductivity, wear resistance and solderability. It is often used for electrical contact plating of electronic components. The plating layer is thin and it is difficult to exceed 1 micron with the current process.
9. Pulse electroplating uses a pulse current with a certain waveform for electroplating, so that the deposition of metal ions is pulsed. This can not only increase the plating speed, but also improve the quality of the coating.