Technological innovation is always an important weight for enterprises to increase product value. On the one hand, CSP chip-level packaging, flip-chip LED and power-off module technology have gradually matured and achieved mass production, which has attracted wide attention in the industry.
Note that the next step is to improve the cost performance; On the other hand, EMC, COB and high-voltage LED markets continue to explode, and the future growth space will be concentrated in market segments.
1, CSP chip-level package
When it comes to the most popular LED technology, CSP is unique. CSP has attracted much attention because it carries the industry's requirements for miniaturization of packaging and expectations for improving cost performance. At present, CSP is gradually applied to the fields of mobile phone flash, display backlight and so on. In short, domestic CSP chip-level packaging is still in the research and development stage, and will develop along the track of improving cost performance. With the continuous release of scale effect of photothermal power generation products, the cost performance will be further improved, and more and more lighting customers will accept photothermal power generation products in the next year or two.
2. Power off module
In recent years, "decentralization" has developed in full swing, so what is "decentralization"? "De-power" means a built-in power supply, reducing some devices such as electrolytic capacitors and transformers, and taking the driving circuit and LED lamp beads as the substrate to realize the high integration of driving and LED light source. Compared with the traditional LED, the power-off scheme is simpler and easier for automation and mass production. At the same time, it can reduce size and cost.
3. Flip-chip LED technology
"Flip chip+chip scale package" is a perfect combination. Flip-chip LED, with its advantages of high density and high current, has become the research hotspot of LED chip enterprises and the mainstream direction of LED industry development in recent two years.
At present, CSP packaging is based on flip chip technology. Compared with front-mounted LED, flip-chip LED saves the link of gold wire, which can reduce the probability of dead lamp above 905, ensure the stability of the product and optimize the heat dissipation ability of the product. At the same time, it can bear more current drive in a smaller chip area, obtain higher luminous flux and be thinner, which is the best solution for super current drive in lighting and backlight applications.
4.EMC packaging
EMC refers to epoxy plastic packaging material, which has the characteristics of high heat resistance, ultraviolet resistance, high integration, high current, small size and high stability, and has outstanding advantages in the fields of bulb lamps with high heat dissipation requirements, outdoor lamps with higher ultraviolet resistance and high stability backlight.
It is understood that EMC currently has several models, such as 3030, 5050 and 7070, among which 3030 has been quite outstanding in cost performance. At the 20 15 Guangya Exhibition, 3030 packaging products can be seen everywhere, in addition to domestic Ruifeng, Smad, Li Hong, Tiandian and Yiguang, as well as international big coffees such as Osram and Seoul.
5, high voltage LED packaging
At present, the price war of LED is fierce, and power supply occupies a prominent proportion in the cost of LED lighting. How to save the driving cost has become the focus of LED driving power supply enterprises. High-voltage LED can effectively reduce the cost of power supply and is recognized as one of the future development trends of the industry.
At present, the common method to improve the brightness of LED is to increase the chip size or increase the working current, but it is not easy to fundamentally solve the problem, and may even lead to new problems, such as uneven current, poor heat dissipation, droop effect and so on. , but high-voltage chips provide a better solution.
In fact, the principle of high-voltage chip is to break the larger chip into small chips with high luminous efficiency and uniform luminous, and integrate them through semiconductor manufacturing technology to make full use of the chip area and achieve the purpose of improving brightness more effectively. From the point of view of the whole lamp (such as street lamp), the voltage difference borne by the high-voltage chip powered by IC becomes smaller, which not only increases the service life, but also reduces the cost of the system.
6.COB integrated package
COB integrated light source is widely used in commercial lighting field because it is easier to realize dimming, anti-glare and high brightness, and can solve the problems of color difference and heat dissipation, and is favored by many LED packaging manufacturers.
At present, COB is facing the process of customization demand, and the future COB market will develop in the direction of standardized products. Because the COB upstream and downstream facilities are mature and cost-effective, once the universality is solved, the scale will be further accelerated.
In this field, with the acquisition of Luxvue by Apple, micro LED has become a new hot spot. A strong proof of these diversified development trends is that the number of manufacturers in the ultraviolet LED industry has doubled in the past three years. Although the market of invisible LED (only 1.1.70 billion dollars in 20 15 years) is still small compared with that of visible LED, the growth trend in the next few years is considerable (it is expected to exceed1billion dollars in 20021year).
This report comprehensively investigates the LED packaging industry and market trends (global+China), and analyzes the recent development status and trends (technology, industry and market) in detail; Visual LED (onboard chip, flip chip, filament, etc. ); Niche applications (car lighting, etc.). ); Invisible LED (ultraviolet LED, infrared LED); Vertical integration (LED module); And new devices (micro light emitting diodes).
The achievements of China's industrial subsidy policy appeared, and local industries began to take off, eroding the market share of other parts of the world.
LED market revenue in 20 15 years (broken down by region)
China LED packaging manufacturers have gained a stable market position in the backlight display market, and they have been able to imitate foreign advanced technology very skillfully to gain more market share in the general lighting market.
At present, China is the main manufacturing base of global LED lighting products, and all major OEMs and ODM manufacturers have set up factories in China. The development wave of LED lighting industry is promoting the continuous expansion of local market and industry. In 20 15, the revenue of China LED packaging manufacturers, including MLS (Mulinsen), Nationstar (National Star Electronics) and Hongli Electronics (Li Hong Optoelectronics), was 2.9 billion US dollars, accounting for 19.3% of the global LED market revenue.
This report introduces the LED packaging industry in China in detail, and analyzes the global LED packaging industry (driving force, market share, etc. ), and especially introduced the top 30 manufacturers (revenue, production capacity, etc.). ) In this field.
For material suppliers, the LED packaging industry is still full of opportunities.
The income of LED packaging materials ranges from 20 12 to 202 1
With the rise of general lighting market, LED packaging requires packaging materials to meet the application requirements. For packaging substrates, ceramic substrates are used for high power density devices, and the market is expected to grow from $684 million in 20 15 to $2021300 million. Driven by more and more applications of silicone materials, sealing/lens materials will also keep growing (it is expected to increase from 400 million US dollars in 20 15 to 526 million US dollars), and silicone materials have higher reliability and longer service life than traditional epoxy materials. For the fluorescent material market, the patent of 20 17 main YAG (yttrium aluminum garnet) will expire soon, and this market will face a lot of product commercialization and price pressure. Therefore, the market in this field is only expected to grow from $339 million in 20 15 to $346 million in 20021year. Web page link