1, different processing ranges
Duv: Basically, it can only reach 25nm. Intel has achieved 10nm by virtue of the two-stage mode, but it can't be achieved below 10nm. Euv: It can meet the wafer manufacturing requirements below 10nm and can be extended to 5nm and 3nm.
2. Different luminous principles
Duv: The light source is excimer laser, and the wavelength of the light source can reach 193 nm. Euv: Laser excites plasma to emit EUV photons, and the wavelength of light source is 13.5 nm.
3, the light path system is different
Duv: Mainly uses the refraction principle of light. Among them, the immersion lithography machine will fill deionized water between the projection lens and the wafer so that the light wave of 193nm is equivalent to 134nm.
Brief introduction of mask aligner
Mask aligner, also known as mask alignment exposure machine, exposure system and lithography system, is the core equipment for manufacturing chips. It uses a technology similar to photo printing to print the fine patterns on the mask onto the silicon wafer through exposure.
The manufacturing of high-precision alignment system needs nearly perfect precision mechanical technology, which is also one of the technical difficulties that domestic mask aligner can't reach. Many American and German brands of mask aligner have special patented mechanical technology designs. Such as mycon &；; Q mask aligner adopts the patented technology of all-pneumatic bearing design, which effectively avoids the process error caused by mechanical friction of bearings.