Thick film technology is to integrate a special integrated circuit chip and related capacitance and resistance elements on a substrate, and make a modular unit by unified packaging outside it. The advantage of this method is to improve the insulation performance and resistance accuracy of this part of the circuit, and reduce the influence of external temperature and humidity, so the thick film circuit has stronger adaptability to the external environment than the independent welding circuit.
Patent Abstract: The thick film technology of high-temperature superconducting materials is to mix the micro-powder of superconducting ceramic materials and organic bonding solvent into paste slurry, print the slurry on the substrate in the form of circuit wiring or pattern through screen printing technology, and sinter it through strict heat treatment procedures to make a superconducting thick film, the thickness of which can be in the range of15-80μ m. The superconducting transition temperature of the film is above 90K, and the zero resistance temperature of the film is above 80K.
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A proces for preparing a thick film of high-temperature superconduct ceramic material is characterized by comprising slurry mixing, film preparation and heat treatment, wherein slurry mix comprises that following steps: adding 400-500 mesh oxide superconducting ceramic micropowder into an organic binder to prepare paste, and the solid-liquid ratio is 3-5/1; Film-making is to print the prepared slurry on the substrate by screen printing or direct brush coating; The superconducting film is sintered by heat treatment. The whole heat treatment process is carried out in oxygen atmosphere. First, it is dried at 80-90℃ for about 0.5 hour, and then heated in a tube furnace at a speed of 2-3℃/ minute. The sequence of temperature and holding time in each stage is: 150℃/ 1-3 hours, 400℃/65438+. 950- 1 100℃/2-4 hours, then cooled with the furnace to 800℃/2-4 hours, 400℃/3-5 hours, and finally naturally cooled to room temperature.