Why use phosphor copper plate instead of pure copper for electroplating copper?

What is the electroplating process of phosphor copper plate?

Phosphor-copper plate electroplating process is a combination of electroplating and other surface treatment technologies, thermal spraying, traditional.

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Mechanism of alloy electroplating.

In the surface treatment technology,

Electroplating is one of the most effective methods.

Electroplating means that in a salt solution containing the metal to be plated,

Under the action of direct current, the base metal to be plated is used as the cathode, and the metal to be plated or other inert conductor is used as the anode.

Functions, in matrix tables

Surface engineering technology can obtain a firmly bonded metal film on the surface.

At present, the crystallizer strengthened by electroplating has single-layer coated copper plate and composite coated copper plate.

The single-layer coating mainly uses chromium or nickel;

Now, the copper plate with composite coating for crystallizer has been developed, such as

Nickel-chromium alloy, nickel-iron alloy, nickel-iron alloy, nickel-iron-cobalt alloy, nickel-cobalt alloy,

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The effect is very good.