(1) [Utility model] A convenient and wear-resistant SMT thermoelectric separation copper substrate-CN201620063525.4 effective patent.
Applicant: Shenzhen Dingyexin Electronics Co., Ltd.
Application date: 20 16-0 1-23- main classification number: H05K7/20.
In the circuit connection layer, a plurality of device connection paste holes are fixedly arranged on the outer side of the FR4 board, and paste hole protection pads are arranged on the outer sides of the device connection paste holes. The SMT thermoelectric separation copper substrate with convenient heat dissipation and wear resistance can efficiently perform heat dissipation treatment of external thermoelectric separation copper substrate equipment, and has high wear resistance.
(2)
[Invention Patent] A production process of COB thermoelectric separation copper substrate-CN 201510295153.8 Substantive review
Applicant: Suining Guangtian Electronics Co., Ltd.
Application date: 2065 438+05-06-02- Main classification number: H05K3/02.
S3 1 browning and pre-stacking, S32 pressing and S33 shooting; S4, testing; S5, solder resist, including the following sub-steps: S5 1, grinding; S52, solder resist; S53: exposure and development; S54: curing; S6, silver plating; S7, printing blue glue for protecting the silver surface; S8, drilling; S9: contour processing; S 10: passed the inspection and got the product. It has the advantages of good heat dissipation effect, good thermal shock resistance, good coating adhesion and low cost, and is suitable for mass production.