it turns out that the new version not only upgraded the internal structure, including the new motherboard and smaller and lighter radiator, but also replaced the host with an updated chip.
According to Angstronomics, the third-generation PS5 mainframe code-named "CFI-122" is equipped with a smaller SoC called "OberonPlus".
this SoC is manufactured by using TSMC's 6nm process, which belongs to the same generation as the 7nm node that has been used in Sony PS5 "Oberon" SOC.
although the 6nm process is adopted, both of them have the same design, and no changes have been made to the processor configuration, including the API. In other words, the underlying Zen2CPU and RDNA2GPU parts have not changed.
▲OberonPlus (left), Oberon (right), Source: Angstromics
Oberon Plus has the same design and specifications as the 7nm Oberon, but the chip is smaller and the power consumption is lower, which has been reduced to 26mm compared with the original 3mm, so the new version of PS5 only needs a slightly smaller heat dissipation scheme.
For AMD and Sony, it also means that they can make more chips with one wafer, so the production cost of the new mainframe may be reduced a little. Not surprisingly, the Xbox series, which is also based on 7nmAMDSoC, will be updated to 6nm design in the future.