The packaging oxidation resistance of carbon-based electronic devices can improve their long-term working stability. Graphene glass fiber fabric (GGFF), as an advanced flexible electrothermal material, is also fighting against graphene oxidation. The flexible, full-surface, conformal packaging of each fiber in large-area fabric puts forward high requirements for packaging materials and technology. In this paper, Peking University and the research group of Academician Liu Zhongfan of Beijing Graphene Research Institute published a paper entitled "Flexible full-surface conformal packaging of each fiber in graphene glass fiber fabric" in the journal of ACS App. Mater. Interfaces. Against GGFF electric heating devices, the h -BN layer with nanometer thickness was grown by in-situ CVD, and the flexible, full-surface conformal packaging of each fiber in large-area fabric was realized.
GGFF encapsulated by H -BN (H-BN/GGFF) shows enhanced oxidation resistance in the atmosphere, and its stable heating duration is 1 order of magnitude longer than that of pure GGFF (about 5 hours at 500 C), without damaging the high flexibility and firmness of the fabric. Theoretical simulation shows that the improvement of oxidation resistance of h -BN/GGFF is attributed to the action of oxygen and the decrease of adsorption life. The proposed flexible, full-surface, conformal packaging technology for fibrous graphene electrothermal devices is extensible, and can be extended to other carbon materials, even devices with complex shapes, which will promote the development of flexible electronics products.
Graphic reading guide
Figure 1. Schematic diagram of preparation of GGFF and h -BN/GGFF.
Figure 2. Improvement of oxidation resistance of H-BN/GGFF.
Figure 3. Theoretical study on antioxidant mechanism of H-BN/GGFF.
Figure 4. Performance of H-BN/GGFF electrothermal devices
summary
In this paper, a flexible full-surface conformal packaging technology for fiber materials has been successfully developed. As an advanced new carbon-based electrothermal fabric, GGFF has been successfully manufactured and demonstrated as an example. The h-BN layer with nanometer thickness is grown in situ on the cambered surface of each fiber in the fabric by CVD method, which realizes large-area flexible packaging of electrothermal fabric and significantly improves the high-temperature oxidation resistance of the device without affecting its performance. Electrothermal performance and flexibility. The proposed packaging technology for fibrous graphene devices is scalable and can be extended to other multifunctional nano-materials and nano-devices, even devices with complex shapes.
Literature:
https://doi.org/ 10. 102 1/acsami.2c02979