Properties of conventional gallium indium tin alloy:
Composition: gallium: indium: tin = 68.5%: 2 1.5%: 10% melting point: 6- 12℃ boiling point: 1300℃
Density at 20℃: 6.44g/cm3 Steam pressure: 10? 8 torr (at 500℃)
Viscosity: 0.0024 Pas (at 20℃) Thermal conductivity: 16.5 w/m/k
Electrical conductivity: 3.46x10-6s/m (at 20℃) Surface tension: 0.718n/m (at 20℃).
Product use: mainly used for thermometers and radiators of electronic equipment, and widely used in semiconductors.
Low melting point alloy refers to fusible alloy whose melting point is lower than 232℃ (the melting point of tin); It is usually composed of low-melting metal elements such as bismuth, tin, lead and indium. Low-melting-point alloys are widely used as solders, as well as fuses, fuses and other heat-sensitive components in appliances, steam, fire fighting and fire alarm devices. They are a new type of low melting point alloy with great development potential.
Application field:
1) is used for medical treatment, mainly used as a special radiation protection stop with a specific shape.
2) It can be conveniently used as a casting mold, a mold for producing special products and casting special products.
3) Used for electronic and electrical automatic control, as heat sensitive components, insurance materials, fire alarm devices, etc.
4) Used as filler when bending metal tube.
5) Used as mosaic agent when making metallographic samples.
Product features:
1. It is a fusible alloy with off-white luster metal, based on bismuth and gallium.
2. Melting points are 6℃, 20℃, 47℃, 70℃, 92℃, 65438 020℃ and so on. Low melting point alloys can be melted by water bath method or oil bath method.
3. Room temperature strength 30MPa, elongation 3%, hardness 25HBS.