CREE's wafer uses a carbon-silicon substrate. It has a patent that the current flows vertically, withstands large currents, high temperature resistance, high brightness, and good antistatic effect. The ohmic contact can be made lower and the voltage is easy to make. Low, the best in the industry.
Bridgelux uses a sapphire substrate, the current flows horizontally, and there are no patent restrictions. Most Taiwanese and domestic manufacturers use this accumulation method and MOCVD production. The process is easy to control and the price is cheap. Compared with CREE chip performance, Just a little bit closer.