Based on the advanced scanning mask aligner platform technology, it provides ArF, KrF and I-line step-by-step scanning projection mask aligner, covering the large-scale production of IC manufacturing nodes above 90nm, including the requirements of nodes with different resolutions such as 90nm, 130nm and 280nm. This series of mask aligner is compatible with 200mm and 300mm silicon wafers.
500 step mask aligner series-later IC and MEMS manufacturing
Based on advanced stepping mask aligner platform technology, it provides stepping projection mask aligner covering IC packaging and MEMS/NEMS manufacturing. This series of mask aligner adopts high-power mercury lamp ghi line as exposure light source, and its advanced field-by-field focusing and leveling technology has good automatic adaptability to thin and thick glue technology and TSV-3D structure. Patented image intelligent recognition technology is adopted, and no special alignment marks need to be specially designed. This series of equipment has a series of advantages such as high resolution, high alignment accuracy and high productivity, which can meet the production requirements of users for high performance, high reliability and low operating cost (chief operating officer).
200 mask aligner series-AM-organic light-emitting diode display manufacturing
200 series projection mask aligner adopts advanced stepping mask aligner platform technology and scanning mask aligner platform technology, which is specially used to manufacture the TFT circuit of a new generation AM- OLED display screen. This series of mask aligner can be used not only in the process research and development line with a substrate size of 200mm × 200mm, but also in the production line of AM- OLED display screens with substrate sizes of G2.5(370mm × 470mm) and G4.5(730mm × 920mm).
Silicon wafer edge exposure machine series-application of chip-level packaging technology
The wafer edge exposure machine developed by SMEE provides the ability to remove wafer edge glue in chip-level packaging process. The equipment can be configured in different forms according to customer requirements, such as edge exposure width, wafer material interface form and exposure station. The equipment is compatible with 150mm, 200mm and 300mm silicon wafers with different specifications, and the edge exposure accuracy can reach 0.1mm. The equipment is equipped with a high-power light source, which has high illumination on the surface of silicon wafers and improved the yield of equipment.
Precision Temperature Control Series —— Application of mask aligner and etching machine
SMEE provides a variety of ultra/high precision temperature control devices for integrated circuit industry, which can be used for precision temperature control of scanning mask aligner in semiconductor front-end equipment and various etching machines, as well as for precision optics, instruments, precision machine tool manufacturing and various scientific experimental places. The temperature accuracy can reach 0.065438 0℃, and the temperature control range can reach -30℃ to 90℃.
Precise temperature control solution
SMEE provides all kinds of ultra-high precision temperature control solutions, which can provide one-stop service from design, manufacturing, installation, debugging to maintenance according to customers' specific needs. Smee can be used in the manufacture of optical lenses, gratings, precision components, precision instruments and precision machine tools, especially in various scientific experimental occasions such as material purification, testing, measurement and positioning.