Common heat dissipation methods of notebooks
The cooling mode of double cooling system The double cooling system consists of three parts: double cooling tubes, double cooling plates and metal brackets. ThinkPad series notebooks adopt this heat dissipation method, and the heat dissipation effect is much higher than that of ordinary fans through liquid convection in vacuum cooling pipes. Heat pipe is the latest heat dissipation device at present. It should be pointed out that because the heat pipe is a purely physical accessory, it does not need to consume any energy when working. In this way, consumers do not have to worry about battery consumption when the heat pipe works, nor do they have to worry about power consumption and accidents. At the bottom and top of the motherboard, there is a metal radiator, which can better receive the heat generated by the CPU and guide the heat into the heat pipe for processing.
Chassis heat dissipation this way is to use the metal shell of the notebook to dissipate heat. At present, the commonly used aluminum-magnesium alloy case has good heat dissipation, which greatly improves the overall heat dissipation performance of the notebook compared with the traditional plastic case. Another advantage of this design is that it reduces the power consumption and noise caused by unnecessary fan operation, making the system more stable and the standby time longer.
Keyboard heat dissipation method There is a heat dissipation aluminum plate at the bottom of the keyboard, which is in contact with the heat dissipation aluminum plate on the notebook motherboard, so that the heat of the heat dissipation aluminum plate on the motherboard is transferred to the bottom of the keyboard. There are many densely distributed "air holes" on the heat dissipation aluminum plate, and the heat is discharged into the air from these air holes.
Vent cooling mode This is a common cooling mode, and many notebooks are still in use now. Cooling holes are usually designed around and at the bottom of the machine so that internal heat can be discharged from these holes. Some notes also use some special air duct diversion designs, and use the position and internal structure layout of cooling holes to form a better air circulation environment.
Peripheral cooling mode This cooling mode is to strengthen the later cooling, using third-party cooling products, such as cooling base and other equipment.
While adopting conventional cooling methods, various manufacturers have also developed many characteristic technologies in structural design and cooling system. The patented ACS(Advanced Cooling System) technology developed by MSI fully considers the natural process of heat generation, flow and circulation, and then through the reasonable layout of internal components and radiators in the notebook, the heat is smoothly transferred to the direction conducive to heat dissipation, thus effectively solving the heat dissipation problem. The water cooling module developed by NEC uses piezoelectric pump to drive frozen liquid. The new water-cooling module structure organically integrates piezoelectric pump, water tank, aluminum radiator and water circulation channel, which not only enhances the heat dissipation effect, but also effectively reduces the noise.