TinyBGA packaged memory
When it comes to BGA packaging, we can't help but mention the patented TinyBGA technology of Kingmax. TinyBGA is called Tiny Ball Grid Array in English, which belongs to a branch of BGA packaging technology. It was successfully developed by Kingmax company in August 1998. The ratio of chip area to package area is not less than 1:1.14, which can increase the memory capacity by 2 ~ 3 times under the condition of constant volume. Compared with TSOP package products, it has smaller volume, better heat dissipation performance and electrical performance. The memory products with TinyBGA packaging technology are only 1/3 of TSOP packaging in the same capacity. The pins of TSOP package memory are led out from the periphery of the chip, while TinyBGA is led out from the center of the chip. This method effectively shortens the transmission distance of the signal, and the length of the signal transmission line is only 1/4 of that of the traditional TSOP technology, so the signal attenuation is also reduced. This not only greatly improves the anti-interference and anti-noise performance of the chip, but also improves the electrical performance.
the memory in p>TinyBGA package is thinner (the package height is less than .8mm), and the effective heat dissipation path from the metal substrate to the radiator is only .36 mm.. Therefore, TinyBGA memory has higher heat conduction efficiency, which is very suitable for long-term running systems and has excellent stability.