The manufacturing industry of microelectronic information products has developed rapidly in the past 10 years, with an annual growth rate of 6%-7%. In 2002, the global electronics industry manufacturing market reached US$1 trillion: including computers and cellular phones. , routers, DVDs, generator controllers, pacemakers, and more. Asia (excluding Japan) is one of the world's electronics industry manufacturing centers. It includes China, Taiwan and South Korea. Its market accounts for 20% of the global electronics manufacturing market, which is US$200 billion, and its annual growth rate exceeds 10%. The annual growth rate in other parts of the world is only 5%-6%. The electronic materials market is growing with the development of the electronic industry manufacturing market, and the electronic materials market accounts for a considerable market share in the electronic industry manufacturing industry. But for now, electronic material suppliers are mainly dominated by Japanese and American companies. There are only a few companies in Europe, and only one is successful, such as DELO. Asian semiconductor packaging material suppliers (except Japan) have begun to enter the packaging material market. Chang Chun and Eternal companies have become well-known companies in the industry and are expected to become important packaging material suppliers in the future. Suppliers of semiconductor packaging materials (bonding wires) are also dominated by a few companies, such as K&S Corporation of the United States, Heraeus Corporation of Germany, Furukawa Electric Co., Ltd. of Japan, Sumitomo Electric Co., Ltd., and ASM of Taiwan. With the continuous opening of the Chinese market and the huge demand for industrial control, communications, and consumer electronics products, it is expected that by 2010, China will become the world's second largest semiconductor market. In addition, due to the continuous decline in the price of integrated circuits, integrated circuit packaging will occupy an increasingly important position in the production process of integrated circuits. The continuous improvement of integration level makes integrated circuits smaller and smaller, thinner and thinner, and the number of leads is increasing. The accelerated price reduction is a requirement for the eternal development of integrated circuits. The rise of consumer electronics and the rapid development of emerging fields such as IC cards and automobiles will become important factors in the growth of domestic integrated circuit market demand in the next few years. In 2002, the total sales volume of China's integrated circuit market was 366.9 trillion units, with total sales of 147.1 billion yuan. In 2010, the Chinese market demand will reach 80 billion pieces, and the demand will exceed 300 billion yuan. At the same time, China's semiconductor discrete device manufacturing industry has become an important part of the basic electronics industry, and the production scale of semiconductor discrete devices has maintained a steady growth trend in recent years. In 2006, China's total output of integrated circuits was 35.56 billion pieces, and every 10,000 pieces required 400 meters of 0.025mm wire, with a wire consumption of 8,000 kilograms: the total output of semiconductor discrete devices was 70 billion pieces, with a specification of 0.023mm, and every 10,000 pieces required 50 meters. , wire consumption 3000 kg: the total ball welding demand of the two items is 11000 kg. In 2007, the demand for bonding wires in China's packaging market was 22 tons, accounting for 35% of the total global demand. According to the 15% growth rate of the international semiconductor industry, the global demand for bonding wires in 2008 exceeded 90 tons, and mainland China's demand The volume is about 31 tons. Most of the bonding wire market is occupied by imported products. The main units that produce bonding wires in China include: Ningbo Kangqiang Electronic Materials Co., Ltd., Huawei Electronics Co., Ltd. (the bonding wire has been acquired by Heraeus of Germany), Beijing Nonferrous Metals Research Institute, Kunming Precious Metals Research, etc. The product quality is low and the performance is unstable, and it is mainly engaged in the production of bonding gold wire. According to the market survey and forecast of BSEIA World Information Technology Company, the demand for bonding wires in the domestic electronics industry this year is about 40 tons, and with the advent and development of the information age, the demand for bonding wires in the international market will reach 130 tons by 2010. tons or more. This indicates that various bonding materials, especially the newly developed single crystal copper bonding wire materials, will also usher in great opportunities and development. At present, there are no competitive manufacturers in China, and the prices of foreign products are extremely high. After this project is put into operation, the product has strong potential to replace at least about 10% of imported products. According to conservative analysis, this product will have a high potential within 10 years. It is impossible to be saturated. It always maintains strong vitality without new materials to replace it.
In order to vigorously promote the development of China's packaging industry, the country has proposed the content of Chapter 27, Chapter 27, Chapter 7, of the National Eleventh Five-Year Plan for the semiconductor packaging industry during the new five-year plan period: Accelerating scientific and technological innovation and leapfrogging development, in the implementation of the national medium- and long-term science and technology development plan, in accordance with the principles of independent innovation, key leaps, supporting development, and leading the future, accelerating the construction of the national innovation system, continuously strengthening the innovation capabilities of enterprises, and improving the overall scientific and technological strength and industrial technology level of the whole people. , and increase efforts in the development of core electronic devices, high-end general-purpose chips and basic software. It can be seen that as a supporting material for the national microelectronics industry, bonding wires have significant economic and social benefits. This project complies with the national industrial technology policy, has high technical content and strong innovation, and can meet the development needs of the microelectronics packaging industry. It can not only provide high-tech products for the microelectronics industry, but also replace similar imported products and improve the competitiveness of China's microelectronics industry. International competitiveness and shortening the technological gap with advanced countries have very obvious economic and social significance.