Their low-temperature thermosetting adhesive is generally used for bonding chips and circuit boards such as FPC. It is suitable for memory cards, CCD/CMOS, camera modules, lens modules, etc., and is especially suitable for applications that require low-temperature curing. heat sensitive components. The main features are as follows:
1. The appearance of the glue is transparent or black (can be selected according to needs, or the color can be customized);
2. Strong bonding performance and strong impact resistance;
3. When used as a sealant, it has high confidentiality for electronic circuit boards, prevents plagiarism of electronic components on circuit boards, and has excellent weather resistance;
4. It has good low-temperature resistance after curing. Adaptable to a wide temperature range, it still has good confidentiality and a certain hardness at higher temperatures after potting;
5. Glue viscosity and other parameters can be customized