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LQFP, also known as thin QFP (Low profile Quad Flat Package), refers to a QFP with a package body thickness of 1.4mm. It is the name used by the Japan Electronics Machinery Industry Association based on the new QFP outline specifications.
The following is an introduction to QFP packaging:
The Chinese meaning of this technology is called Plastic Quad Flat Pockage (Plastic Quad Flat Pockage). This technology implements between the CPU chip pins The distance is very small and the pins are very thin. Generally, large-scale or very large-scale integrated circuits adopt this packaging form, and the number of pins is generally more than 100. This technology is easy to operate and has high reliability when packaging the CPU; its package size is smaller and its parasitic parameters are reduced, making it suitable for high-frequency applications; this technology is mainly suitable for installing wiring on PCBs using SMT surface mounting technology.
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FBGA is a plastic packaged BGA
The following is an introduction to the BGA package:
With the advancement of technology in the 1990s, chip integration continued to increase, the number of I/O pins increased dramatically, power consumption also increased, and the requirements for integrated circuit packaging became more stringent. In order to meet the needs of development, BGA packaging began to be used in production. BGA is the abbreviation of English Ball Grid Array Package, that is, ball grid array package.
Memory packaged with BGA technology can increase the memory capacity by two to three times without changing the memory size. Compared with TSOP, BGA has a smaller size, better heat dissipation performance and electrical properties. BGA packaging technology has greatly improved the storage capacity per square inch. Memory products using BGA packaging technology are only one-third of the size of TSOP packaging at the same capacity. In addition, compared with traditional TSOP packaging, BGA packaging The method has a faster and more effective way to dissipate heat.
BGA packaged memory
The I/O terminals of the BGA package are distributed under the package in the form of circular or columnar solder joints in an array. The advantage of BGA technology is the number of I/O pins Although it has increased, the pin spacing has not decreased but increased, thereby improving the assembly yield; although its power consumption has increased, BGA can be welded with a controlled collapse chip method, which can improve its electrothermal performance; thickness Compared with the previous packaging technology, the weight and weight are reduced; the parasitic parameters are reduced, the signal transmission delay is small, and the frequency of use is greatly increased; the assembly can be welded on the front surface, and the reliability is high.
When talking about BGA packaging, we must mention Kingmax’s patented TinyBGA technology. TinyBGA’s full English name is Tiny Ball Grid Array (small ball grid array packaging), which is a branch of BGA packaging technology. It was successfully developed by Kingmax Company in August 1998. The ratio of its chip area to package area is not less than 1:1.14, which can increase the memory capacity by 2 to 3 times while maintaining the same volume. Compared with TSOP package products , which has smaller size, better heat dissipation performance and electrical performance.
TinyBGA package memory
Memory products using TinyBGA packaging technology are only 1/3 of the TSOP package with the same capacity. The pins of TSOP packaged memory are led from the periphery of the chip, while the pins of TinyBGA are led from the center of the chip. This method effectively shortens the signal transmission distance. The length of the signal transmission line is only 1/4 of the traditional TSOP technology, so the signal attenuation is also reduced. This not only greatly improves the anti-interference and anti-noise performance of the chip, but also improves the electrical performance.
Chips using TinyBGA packaging can withstand FSBs up to 300MHz, while traditional TSOP packaging technology can only withstand FSBs up to 150MHz.
TinyBGA packaged memory is also thinner (package height is less than 0.8mm), and the effective heat dissipation path from the metal substrate to the heat sink is only 0.36mm. Therefore, TinyBGA memory has higher heat conduction efficiency, is very suitable for systems that run for a long time, and has excellent stability.