What are the advantages and characteristics of LDS innovative technology LAP?

The key problem of LDS is that it needs special modified materials, accounting for about 60% of the final plastic parts cost (the price of LDS PC+ABS raw materials is about 105 yuan; The price of ordinary PC+ABS is around 30 yuan), so it is mainly a bracket antenna. Compared with traditional FPC and other technologies, it has no advantage in price and is difficult to popularize on a large scale. The most important thing is that overseas markets are affected by LPKF patents to some extent, and LPKF-LDS equipment is needed, which is costly. Moreover, after laser engraving, it is difficult to control the consistency of surface metallization treatment because of the inconsistent parameters of various materials, especially in antenna debugging, because modified metal substances are added to the materials, which affects the dielectric constant and is difficult to debug.

LAP was developed by tontop to deal with these characteristics of LDS. LAP has the same stereoscopic properties as LDS, but it does not need special laser-induced materials, and the cost of plastic materials is saved by 50%~70%. In the actual mass production process, under the same defect rate, the cost of high-priced modified materials lost by LDS process will be much higher than that of LAP, especially the middle frame or shell antenna. Moreover, it can be completely realized by domestic laser equipment, with excellent performance and price, completely independent intellectual property rights, and is not affected by LDS overseas patents. Basically suitable for all common plastic substrates, including PC, PC/ABS, ABS, glass, ceramics and so on. Moreover, because the ordinary substrate does not need to add modified materials, antenna debugging will not be affected by dielectric constant, which is more conducive to antenna debugging design.