Photodiode package structure
The application number is 2010/0191056.1.
Date of application: 20 10-06-03
Applicant (patent right) Zhan Jing Science and Technology (Shenzhen) Co., Ltd. Sunac Energy Technology Co., Ltd.
Address: 5 18 109, East Ring of Pinus tabulaeformis 10th Industrial Zone, Longhua Sub-district Office, Baoan District, Shenzhen City, Guangdong Province.
Er Lu er Hao
Inventor (Designer) Liao Qiwei Zeng Liang Wen Ye Jinlian Xie Ming Village, Lin Zhiyong
Main classification number h 01l 33/50 (2010.01) i.
Classification number H 01L 33/50 (2010.01) I H 01L 33/48 (2010.05438+0) i.
AnnouncementNo. 102270732A
Release date (announcement): 2011-12-07
Patent agency
agent
(54) Name of invention
Fluorescent layer structure, forming method thereof and light emitting diode package
Mounting structure
(57) Abstract
The invention relates to a fluorescent layer structure, which comprises first fluorescent layers which are overlapped with each other.
An optical layer and a second fluorescent layer. The first fluorescent layer includes a plurality of stripes.
First phosphor stripes and second phosphor layers arranged at intervals.
Comprises a plurality of second fluorescent strips arranged at intervals. above-mentioned
The maximum distance between every two adjacent first fluorescent strips, and
Maximum distance between every two adjacent second fluorescent strips.
Compared with the prior art, the fluorescent laminate of the invention
Fluorescence is achieved by arranging fluorescent bands at intervals.
The uniformity of phosphor in the optical layer structure is controlled to make it emit light.
The light emitted by the diode is more evenly mixed and the light output efficiency is better.
The invention also provides a method and a device for forming the fluorescent layer structure.
A light emitting diode packaging structure with a fluorescent layer structure.
1. A fluorescent layer structure, characterized in that the fluorescent layer structure comprises a first fluorescent layer and a second fluorescent layer which are overlapped with each other.
A fluorescent layer, wherein the first fluorescent layer comprises a plurality of first fluorescent powder bands arranged at intervals, and the second fluorescent layer is internally wrapped.
Comprises a plurality of second fluorescent strips arranged at intervals.
2. The fluorescent layer structure according to claim 1, wherein every two adjacent first fluorescent strips
And the maximum distance between every two adjacent second fluorescent strips is less than1mm. ..
3. The fluorescent layer structure according to claim 1, wherein in the first fluorescent layer, the plurality of first fluorescent agents
The fluorescent powder strips are concentric first annular fluorescent powder strips separated from each other, and every two first annular fluorescent powder strips are adjacent.
The first transparent region is arranged between the first annular phosphor strips, and in the second phosphor layer, a plurality of second phosphor strips
Are concentric and mutually spaced second annular fluorescent strips, and every two adjacent second fluorescent strips in a plurality of second annular fluorescent strips
A second transparent region is arranged between the annular fluorescent powder strips, and the first annular fluorescent powder strip intersects with the second transparent region.
Overlapping, wherein the second annular phosphor band and the first transparent region overlap each other.
4. The fluorescent layer structure according to claim 1, characterized in that the fluorescent layer structure is in the shape of a hemispherical shell, which
The circular bottom includes a first point, a second point, a third point and a fourth point, and the circular bottom of the fluorescent layer structure is located on a plane.
The connecting line between the first point and the second point and the connecting line between the third point and the fourth point on the plane are perpendicular to each other, and a plurality of first fluorescent lamps
The fluorescent powder strips are a plurality of first arc-shaped fluorescent powder strips extending from a first point to a second point and arranged at intervals; the fluorescent powder strips
The plurality of second fluorescent strips are a plurality of second arc-shaped fluorescent strips extending from the third point to the fourth point and arranged at intervals.
Glossy ribbon.
5. The fluorescent layer structure according to claim 1, wherein in the first fluorescent layer, the plurality of first fluorescent agents
The phosphor strips are first strip-shaped phosphor strips arranged in parallel with each other at intervals, and in the second phosphor layer, a plurality of second phosphors
The powder bands are second strip-shaped phosphor bands arranged in parallel at intervals, and the first strip-shaped phosphor bands and the first strip-shaped phosphor bands are connected with each other.
Two fluorescent strips are staggered to form a grid.
6. The fluorescent layer structure according to claim 1, 3, 4 or 5, wherein the first fluorescent band and the fluorescent layer structure
The second phosphor bands include at least a red phosphor band and a green phosphor band, respectively.
7. A light-emitting diode packaging structure, comprising an accommodating cup and a light-emitting diode chip arranged in the accommodating cup.
And a fluorescent layer structure covering the LED chip, characterized in that the fluorescent layer structure comprises mutually superposed layers.
A first fluorescent layer and a second fluorescent layer, wherein the first fluorescent layer comprises a plurality of first phosphor bands arranged at intervals, and
The second fluorescent layer comprises a plurality of second fluorescent powder bands arranged at intervals, and every two adjacent first fluorescent powder bands
And the maximum distance between every two adjacent second fluorescent strips is less than1mm. ..
8. The LED package structure according to claim 7, wherein the accommodating cup comprises an accommodating groove,
The accommodating groove comprises a bottom surface and a top opening, and the LED chip is arranged on the bottom surface of the accommodating groove.
In fact, the fluorescent layer structure covers the top opening of the holding cup.
9. A method for forming a fluorescent layer structure, comprising the following steps.
Steps:
Mixing the first fluorescent powder into colloid and injection molding to form a plurality of first fluorescent powder bands;
Mixing second fluorescent powder into colloid and injection molding to form a plurality of second fluorescent powder bands;
A plurality of first phosphor bands and a plurality of second phosphor bands are mixed in a transparent colloid at intervals respectively.
Manufacturing a first fluorescent layer and a second fluorescent layer, wherein every two adjacent first fluorescent powder strips and second fluorescent powder strips
The maximum distance is less than1mm;
The first fluorescent layer and the second fluorescent layer overlap each other and are then pressed to form a fluorescent layer structure.
10. A method for forming a fluorescent layer structure is characterized by comprising the following steps.
Steps:
Mixing the first fluorescent powder into colloid and injection molding to form a plurality of first fluorescent powder bands;
Mixing second fluorescent powder into colloid and injection molding to form a plurality of second fluorescent powder bands;
Arranging the first fluorescent powder band and the second fluorescent powder band at intervals, and adding transparent colloid to mix;
Pressing the transparent colloid mixed with the first fluorescent powder band and the second fluorescent powder band to form a fluorescent layer junction.
Structure.
Fluorescent layer structure, forming method thereof and light emitting diode packaging structure
Technical field
The invention relates to a fluorescent layer structure, a forming method thereof and a light emitting diode packaging structure.
technical background
Light-emitting diodes (LEDs) are widely used in various light sources because they are small in size and can emit bright colored light with good efficiency.
In order to make light emitting diodes emit light of different colors, it is common practice to mix phosphors of various colors in the package at present.
A fluorescent layer is formed in the packaging material and then coated on the light-emitting chip, and the fluorescent layer is excited by the light emitted by the light-emitting chip.
Phosphor, thereby generating light of a desired color. For example, a yellow phosphor is formed on a blue light emitting diode, and is formed by
The yellow and blue beams are mixed to form white light. Similarly, red and green phosphors can be used to emit blue light.
Diode mixing can realize white light with lower color temperature and higher color rendering. But directly put red and green
When phosphors are mixed into the encapsulation colloid, the degree of light mixing cannot be effectively controlled, resulting in poor luminous efficiency and light mixing of led.
The effect is poor.
Summary of the invention
In view of this, it is necessary to provide a fluorescent layer structure with good light mixing effect and luminous efficiency and its forming method.
And LED package structure.
[0004] The fluorescent layer structure includes a first fluorescent layer and a second fluorescent layer which are overlapped with each other. In the first fluorescent layer
Comprises a plurality of first phosphor stripes arranged at intervals, and a plurality of second phosphor stripes arranged at intervals are contained in a second phosphor layer.
Fluorescent tape. Maximum distance between every two adjacent first phosphor strips and every two adjacent second phosphor strips.
The maximum distance between powder bands is less than 1 mm.
[0005] A method for forming a fluorescent layer structure comprises the following steps:
[0006] Mixing the first fluorescent powder into colloid and injection molding to form a plurality of first fluorescent powder bands;
[0007] Mixing second fluorescent powder into colloid and injection molding to form a plurality of second fluorescent powder strips;
[0008] A plurality of first phosphor strips and a plurality of second phosphor strips are arranged at intervals and mixed in the transparent layer.
In the colloid, a first fluorescent layer and a second fluorescent layer are made, and every two adjacent first phosphor bands and second phosphor bands
The maximum distance between them is less than 1 mm;
[0009] The first fluorescent layer and the second fluorescent layer are overlapped with each other, and then pressed to form a fluorescent layer structure.
[00 10] A method for forming a fluorescent layer structure comprises the following steps:
[00 1 1] mixing the first phosphor powder into colloid and injection molding to form a plurality of first phosphor strips;
[00 12] mixing the second fluorescent powder into colloid and injection molding to form a plurality of second fluorescent powder strips;
[00 13] After the first phosphor stripes and the second phosphor stripes are arranged at intervals, transparent colloid is added and mixed.
Close;
[00 14] The transparent colloid mixed with the first fluorescent band and the second fluorescent band is pressed to form a fluorescent layer.
Structure.
[00 15] A light-emitting diode package structure includes an accommodating cup and a light-emitting diode core arranged in the accommodating cup.
And a fluorescent layer structure covering the LED chip. The fluorescent layer structure includes first fluorescent layers overlapping with each other.
And a second fluorescent layer. The first fluorescent layer comprises a plurality of first fluorescent powder bands arranged at intervals, and the second fluorescent powder
The layer includes a plurality of second fluorescent strips arranged at intervals. Maximum value between every two adjacent first fluorescent bands
The distance between every two adjacent second fluorescent strips and the maximum distance are less than1mm. ..
Compared with the prior art, the fluorescent layer structure of the light-emitting diode packaging structure of the invention comprises a stacked first fluorescent layer.
A powder layer and a second phosphor layer, wherein a plurality of first phosphor strips are arranged in the first phosphor layer at intervals, and the second phosphor
A plurality of second fluorescent strips are arranged in the optical layer at intervals, and fluorescence can be realized by arranging the fluorescent strips at intervals.
The uniformity of the phosphor in the optical layer structure is effectively controlled, so that the light mixing effect of the light emitted by the light emitting diode is improved.
The light effect is better.
Brief description of drawings
[00 17] Figure 1 is a top view of the LED package structure in the first embodiment of the present invention.
[00 18] fig. 2 is a schematic cross-sectional view of the LED package structure in fig. 1 along the direction II-II.
[00 19] fig. 3 is a top view of an LED package structure in a second embodiment of the present invention.
Fig. 4 is a schematic cross-sectional view of the LED package structure in fig. 3 along the direction IV-IV.
[002 1] fig. 5 is a top view of an LED package structure in a third embodiment of the present invention.
Fig. 6 is a schematic sectional view of the LED package structure in fig. 5 along the VI-VI direction.
Symbolic description of main components
[0024] LED package structure 10, 20, 30
[0025] Cups 100
The light emit diode chip 200
[0027] Fluorescent layer structures 300, 400, 500
[0028] The first fluorescent layer 3 10, 4 10, 5 10.
[0029] The second fluorescent layers 320, 420, 520
[0030] Accommodation tank 1 10
[003 1] Bottom11/
[0032] Top opening 1 12
[0033] The first annular phosphor band 3 1 1
[0034] The second annular phosphor strip 32 1
[0035] The first arc-shaped phosphor band 4 1 1
[0036] The second arc-shaped phosphor strip 42 1
The first stripe phosphor stripe 5 1 1.
Second stripe phosphor stripe 52 1
First point 400a
Second point 400b
[004 1] third point 400c
[0042] fourth point 400d
expand on
The present invention will be described in further detail with reference to the attached drawings.
Example 1
[0045] Referring to Figure 1 and Figure 2, a light-emitting diode packaging structure 10 includes a cup 100 arranged on the light-emitting diode packaging structure.
Accommodate the LED chip 200 in the cup 100 and the fluorescent layer structure 300 covering the LED chip 200.
[0046] The holding cup 100 includes a holding groove 1 10, which includes a bottom surface11and a top.
Part opening 1 12.
[0047] The LED chip 200 is disposed on the bottom surface11of the accommodating groove 10, and the light emitted by the LED chip 200 is emitted by.
The top opening110 of the accommodating slot10 is ejected. In this embodiment, the LED chip 200 is blue.
Chromophore luminescent particles.
The fluorescent layer structure 300 includes a first fluorescent layer 3 10 and a second fluorescent layer 320 that overlap with each other. first
The fluorescent layer 3 10 includes a plurality of concentric first annular fluorescent bands 3 1 1 spaced apart from each other, and the plurality of first annular fluorescent bands
In the vermicelli 3 1 1, a first transparent region 3 12 exists between every two adjacent first annular phosphor strips 3 1 1. Second fluorescence
The optical layer 320 includes a plurality of concentric and mutually spaced second annular phosphor strips 32 1, which
In the strip 32 1, a second transparent region 322 exists between every two adjacent second annular phosphorescent strips 32 1. First fluorescence
When the layer 3 10 and the second fluorescent layer 320 overlap each other, the first annular phosphor stripe 3 1 1 and the second annular phosphor stripe 3 1.
The phosphor strips 32 1 are staggered with each other, wherein the first annular phosphor strip 3 1 and the second phosphor layer 320 are the same.
Two transparent regions 322 overlap each other, and the second annular phosphor strip 32 1 is in contact with the first transparent layer 3 10.
The bright areas 3 12 overlap each other. The distance between every two adjacent first annular fluorescent strips 3 1 1 and the distance between every two adjacent first annular fluorescent strips 3 1
The maximum distance between two adjacent second annular fluorescent bands 32 1 is less than 1mm, so that the fluorescent band spacing can be avoided.
This is too large to achieve effective uniform light mixing. In this embodiment, first,
The annular fluorescent band 3 1 1 is a green annular fluorescent band and the second annular fluorescent band 32 1 is a red annular fluorescent band.
In an embodiment of the present invention, the red phosphor may be a sulfide or nitride phosphor, such as Y2O2S:(Eu, Gd,
bi)； (Switzerland, Canada) Switzerland: (EU, EU); sry2s 4:Eu； CaLa2S:Ce or CaSiN2:Ce. Sulfur can be used as the green phosphor.
Compounds, nitrides or silicates, such as (Sr, Ca, Ba)(Al, Ga) 2S: EU; SRS i2o 2n 2:Eu； Staff representatives: (EU,
ce)； ZnS: (copper, aluminum) or Ca2MgSi2O7:Cl.
[0049] Of course, in embodiments different from the present invention, the first annular phosphor band 3 1 1 may also be a red ring.
And the second annular phosphor band 32 1 may also be a green annular phosphor band.
[0050] In the packaging process, the fluorescent layer structure 300 covers the top opening of the holding cup 10012. luminous
The light emitted by the diode chip 200 excites the fluorescent layer structure 300 to generate mixed light with different wavelengths. fluorescence
In the layer structure 300, fluorescent strips are arranged at intervals, so that phosphors in the phosphor layer structure 300 can be realized.
Uniformity control, so that the light mixing effect and light extraction efficiency of light emitted by light emitting diodes are better.
[005 1] Example 2
[0052] Please refer to Figures 3 and 4. The LED package structure 20 provided in the second embodiment of the present invention is similar to the above structure.
The LED package structure 10 in the first embodiment is different in the structure of the fluorescent layer.
[0053] In the second embodiment of the present invention, the fluorescent layer structure 400 has a hemispherical shell shape, which includes each other.
The first fluorescent layer 4 10 and the second fluorescent layer 420 overlap. The circular bottom of the fluorescent layer structure 400 includes a first point.
400a, the second point 400b, the third point 400c and the fourth point 400d are located at the circular bottom of the fluorescent layer structure 400.
The connecting line between the first point 400a and the second point 400b and the connecting line between the third point 400c and the fourth point 400d on the plane.
Perpendicular to each other. Extending from a first point 400a to a second point 400b forms a plurality of first arcs arranged at intervals.
The A-shaped fluorescent stripes 4 1 1 extending from the third point 400c to the fourth point 400d are formed by a plurality of first and second fluorescent stripes arranged at intervals.
Two arc-shaped fluorescent strips 42 1. When the first fluorescent layer 4 10 and the second fluorescent layer 420 overlap each other, the first fluorescent layer 4 10
The arc-shaped fluorescent strip 4 1 1 and the second arc-shaped fluorescent strip 42 1 cross each other. Every two adjacent first arc fluorescent lamps
The maximum distance between phosphor stripes is 4 1 1 and the maximum distance between every two adjacent second arc-shaped phosphor stripes is 42 1.
Both of them are less than 1mm, which can avoid stripe luminescence caused by excessive spacing of phosphor stripes and cannot achieve effective uniformity.
The problem of uniformly mixing light. In this embodiment, the first arc fluorescent strip 4 1 1 is a red arc fluorescent strip, and the first arc fluorescent strip
The two arc-shaped phosphor bands 42 1 are green arc-shaped phosphor bands, and the red phosphor can adopt sulfide or nitride fluorescence.
Optical powder, such as Y2O2S:(Eu, Gd, Bi); (Switzerland, Canada) Switzerland: (EU, EU); sry2s 4:Eu； CaLa2S:Ce or CaSiN2:Ce. above-mentioned
The green phosphor can be sulfide, nitride or silicate phosphor, such as (Sr, Ca, Ba)(Al, Ga) 2S: EU;
SRS i2o 2n 2:Eu； Employee representatives: (EU, EC); ZnS: (copper, aluminum) or Ca2MgSi2O7:Cl.
[0054] Of course, in different embodiments from the present invention, the first arc-shaped phosphor band 4 1 1 can also be a green arc.
The second arc-shaped fluorescent strip 42 1 may also be a red arc-shaped fluorescent strip.
[0055] The fluorescent layer structure 400 is arranged on the accommodating cup 100, and the LED chip 200 emits light.
After the light passes through the fluorescent layer structure 400, mixed light with different wavelengths is generated, so that the light emitted by the light emitting diode
Linear light mixing effect and light extraction efficiency are better.
Example 3
[0057] Please refer to Figures 5 and 6. The LED package structure 30 provided in the third embodiment of the present invention is similar to that described above.
The LED package structure 10 in the first embodiment is different in the structure of the fluorescent layer.
In the third embodiment of the present invention, the fluorescent layer structure 500 includes first fluorescent layers 5 10 overlapping with each other.
And a second fluorescent layer 520. The first phosphor layer 5 10 includes a plurality of first stripe phosphors arranged in parallel at intervals.
The band 5 1 1, and the second fluorescent layer 520 includes a plurality of second stripe-shaped phosphor bands 52 1 arranged in parallel and at intervals. place
When the first fluorescent layer 5 10 and the second fluorescent layer 520 overlap, a plurality of first strip-shaped fluorescent strips 5 1 1 and the second fluorescent layer 520 overlap.
A plurality of second stripe-shaped phosphor strips 52 1 intersect and form a grid shape. Every two adjacent first strip-shaped phosphors
The maximum distance between stripes 5 1 1 and the maximum distance between every two adjacent second stripe phosphor stripes 52 1 are smaller.
In this embodiment, the first stripe phosphor stripe 5 1 1 is a green stripe phosphor stripe and the second stripe phosphor stripe
The phosphor band 52 1 is a red stripe phosphor band, and the red phosphor may be a sulfide or nitride phosphor.
For example, Y2O2S:(Eu, Gd, Bi); (Switzerland, Canada) Switzerland: (EU, EU); sry2s 4:Eu； CaLa2S:Ce or CaSiN2:Ce. green
The color phosphor can be sulfide, nitride or silicate phosphor, such as (Sr, Ca, Ba)(Al, Ga) 2S: EU;
SRS i2o 2n 2:Eu； Employee representatives: (EU, EC); ZnS: (copper, aluminum) or Ca2MgSi2O7:Cl.
[0059] Of course, in embodiments different from the present invention, the first stripe phosphor stripe 5 1 1 may also be a red stripe.
The second stripe phosphor strip 52 1 may also be a green stripe phosphor strip.
[0060] The fluorescent layer structure 500 is arranged on the accommodating cup 100, and the LED chip 200 emits light.
After the light passes through the fluorescent layer structure 500, mixed light with different wavelengths is generated, so that the light emitted by the light emitting diode
Linear light mixing effect and light extraction efficiency are better.
[006 1] The present invention also provides a method for forming a fluorescent layer structure, which is the first preferred embodiment of the present invention.
The forming method of "X" includes the following steps:
[0062] Step 1, mixing the first fluorescent powder into colloid and injecting into the colloid to form a plurality of first fluorescent powder strips. Zaiben
In one embodiment, the first phosphor band is a red phosphor band, and the red phosphor is sulfide or nitride.
Phosphors, such as Y2O2S:(Eu, Gd, Bi); (Switzerland, Canada) Switzerland: (EU, EU); sry2s 4:Eu； CaLa2S:Ce or CaSiN2:Ce.
[0063] Step 2, the first phosphor stripes are arranged at intervals and mixed in transparent colloid, and then manufactured and molded.
A first phosphor layer, wherein the maximum distance between every two adjacent first phosphor strips in the plurality of first phosphor strips is less than
1 mm.
[0064] Step 3, the second fluorescent powder is mixed into colloid and injection molded to form a plurality of second fluorescent powder strips. Zaiben
In this embodiment, the second phosphor belt is a green phosphor belt, and the green phosphor adopts sulfide, nitride or silicon.
Phosphors of acidic salts, such as (Sr, Ca, Ba)(Al, Ga) 2S: EU; SRS i2o 2n 2:Eu； Employee representatives: (EU, EC); Zinc: (copper, aluminum)
Or Ca2MgSi2O7:Cl.
[0065] Step 4, the plurality of second phosphor stripes are arranged at intervals and mixed in a transparent colloid to prepare second phosphor stripes.
A fluorescent layer, wherein the maximum distance between every two adjacent second fluorescent strips in the plurality of second fluorescent strips is less than 65438+/-0 mm. ..
[0066] Step 5, the first fluorescent layer and the second fluorescent layer are overlapped with each other, and then pressed to form fluorescence.
Layer structure.
[0067] The method of forming the fluorescent layer structure in the second preferred embodiment of the present invention includes the following steps:
[0068] Step 1, the first phosphor powder is mixed into colloid and injected into the colloid to form a plurality of first phosphor strips.
[0069] Step 2, the second fluorescent powder is mixed into colloid and injection molded to form a plurality of second fluorescent powder strips.
[0070] Step 3, after the first phosphor stripes and the second phosphor stripes are arranged at intervals, transparent materials are added.
Colloidal mixing.
[007 1] Step 4, pressing the transparent colloid mixed with the first fluorescent band and the second fluorescent band to form a shape.
Forming a fluorescent layer structure.
Compared with the prior art, the fluorescent layer structure of the light-emitting diode packaging structure of the invention comprises a stacked first fluorescent layer.
A powder layer and a second phosphor layer, wherein a plurality of first phosphor strips are arranged in the first phosphor layer at intervals, and the second phosphor
A plurality of second fluorescent strips are arranged in the optical layer at intervals, and fluorescence can be realized by arranging the fluorescent strips at intervals.
The uniformity of the phosphor in the optical layer structure is effectively controlled, so that the light mixing effect of the light emitted by the light emitting diode is improved.
The light effect is better.
It can be understood that a person skilled in the art can do this according to the technical concept of the present invention.
Various other corresponding changes and deformations are shown, and all these changes and deformations should belong to the protection scope of the claims of the present invention.
Wai.