Integrated circuit design
Unigroup Guoxin (suspended at 30.88): Tongfang Guoxin has benefited from the increase in the penetration rate of localization of military chips and the horizontal expansion of military memory. China's military chip market has a capacity of 6 billion yuan and a localization rate of 10. There is huge room for domestic substitution in the future. Tongfang Guoxin's smart cards/intelligent terminals also experienced rapid growth in 2015, and domestic bank cards, health card chips, etc. are expected to gradually explode.
Datang Telecom (16.69 -1.30): Leading in baseband technology and exclusive in China for automotive semiconductor chips. Lianxin Technology, a subsidiary of the company, is one of the major domestic TD-SCDMA and LTE baseband/AP chip design companies. It has a large number of communication patents, and the chips are licensed to companies invested by Xiaomi. It is expected to have a place in the 4G chip field in the future.
Shanghai Belling (13.08 -0.76): The path for China Electronics to integrate its integrated circuit assets has become increasingly clear. As its only A-share listing platform, Shanghai Belling’s capital operation deserves attention. In 2014, China Electronics integrated its IC design assets such as Huada and Huahong to establish Huada Semiconductor, ranking among the top three in the country in terms of industry revenue.
Integrated circuit manufacturing
Sanan Optoelectronics (15.82 -1.86): The company plans to manufacture compound semiconductors and become the global leader. Sanan Optoelectronics is the first to enter the 6-inch GaN field in China, and is expected to integrate manufacturing and design in the future to become a leader in compound semiconductors.
Silan Micro (6.24 -0.79): The company is China's leading IDM. The company's main products include discrete devices, power devices, LED drivers, MEMS sensors, IGBTs, security monitoring chips, etc. In the future, the company will develop according to seven major product lines: power supply and power driver product line, digital audio and video product line, Internet of Things product line, MCU product line, mixed signal and radio frequency product line, discrete device product line, and LED device product line.
Huawei Electronics (8.55 -1.04): The company is a major domestic semiconductor power device IDM. Its main products include MOSFETs, IGBTs, BJTs, diodes, etc., which can be used in automotive electronic equipment.
Integrated circuit packaging and testing
Huatian Technology: China's second largest semiconductor packaging and testing company in terms of revenue and the most profitable. The company has traditional packaging in Gansu, Xi'an and Kunshan. to a full line of advanced packaging products. At the beginning of this year, the company signed a strategic cooperation agreement with Huatian Technology. The two parties will cooperate in advanced manufacturing, packaging and testing of integrated circuits, and jointly build China's integrated circuit industry chain.
Tongfu Microelectronics (10.95 -0.90): An important sealing and testing partner of the giant. The company’s international major customers account for a relatively high proportion of revenue, and overseas sales account for more than 70%. Customer products are mainly targeted at smartphones, automobiles and other high-end products. growth market.
Jingfang Technology (32.86 -0.54): The company is the absolute leader in packaging. In 2014, it became the world’s first 12-inch WLCSP packaging supplier, providing packaging for domestic and overseas CIS giants such as OmniVison and Geke Micro. Testing service. At the same time, the company is also one of the main suppliers of Apple Touch ID packaging. The company's main development directions are automotive cameras, module packaging, fingerprint recognition and MEMS packaging.
Integrated circuit equipment and materials
Qixing Electronics: The company is the leading company in A-share semiconductor equipment. Among the company's 962 million revenue in 2014, semiconductor equipment reached 464 million yuan, accounting for 48.2%. Qixing's semiconductor equipment is mainly used in integrated circuits, solar (14.35 -1.03) batteries, TFT-LCD, power electronics and other industries. In terms of integrated circuit equipment, the company's 12-inch oxidation furnace, 65~28nm cleaning equipment, 45~32nm LPCVD, etc. are highlights.
Xingsen Technology (6.94 0.29), Shanghai Xinyang (32.22 -1.47): The 12-inch large silicon wafer project provides the core material for China's integrated circuits. The two companies were established in conjunction with Xinan Technology and Dr. Zhang Rujing Shanghai Xinsheng, a large silicon wafer company, expects to produce 12-inch silicon wafer samples in the fourth quarter and is expected to achieve mass production in the first quarter of next year. Currently, most of the silicon wafer production capacity has been booked. Shanghai Xinsheng will make up for the lack of core raw materials in China’s semiconductor industry. A large national fund is interested in investing, and Shanghai Xinsheng has decided to settle in the Lingang Industrial Park Integrated Circuit Base, which is expected to benefit from the support of the Shanghai Integrated Circuit Fund.