Company Profile: Keda Semiconductor Co., Ltd. was established in June 2007, located in Dongying Economic Development Zone, Shandong Province, with a registered capital of 50 million yuan. It is a Sino-foreign joint venture jointly invested by Keda Group (stock code: 600986) and American STP Technology Company. The company mainly designs, produces and sells IGBT, MOSFET, FRD, power management devices and other power semiconductor products. The company has a branch in Shanghai, which is responsible for foundry management, technical support and sales in East China. There is a sales center in Shenzhen, which is responsible for sales in South China. ? The company has established a complete power semiconductor testing laboratory and reliability laboratory, and has a large number of world-leading static and dynamic parameter testing and reliability testing equipment for chips and devices, which is at the leading level in China in terms of equipment level and testing ability. In terms of static parameter testing, the maximum voltage testing ability can reach 2000V and the maximum current testing ability can reach 200 A；; In the aspect of dynamic performance test, we have a set of dynamic parameter test system made by TESEC in Japan, which can complete all dynamic parameter tests; The reliability laboratory can meet all the routine reliability test requirements of power equipment. In addition to meeting the testing needs of the company's products, the testing laboratory can also provide testing services to the outside world. ? The company has built a domestic first-class ultra-thin wafer back processing factory in Dongying City, Shandong Province, specializing in power semiconductor wafer thinning, etching, back metallization, ion implantation and other processing businesses. The factory can provide professional OEM services to the outside world. ? On June 20 10, the packaging and testing factory started construction. The first phase of the project will be put into production on June 201kloc-0/65438, mainly for the packaging of IGBT, MOSFET, triode, diode and other power devices, and the packaging forms include TO220, TO247 and TO3P. The second phase of the project is scheduled to start in June, 20 1 1, mainly engaged in the packaging test of ultra-thin IC chip series and DFN and QFN forms. The packaging factory takes OEM as its main operation mode and provides professional semiconductor packaging and testing services to customers all over the world. Contact information: Company headquarters address: No.65, Fu Qian Street, Economic Development Zone, Dongying City, Shandong Province Zip code: 25709 1 Website: www.kedasemi.com Tel: +86-546-830 1856 Mobile phone: 1335662 1300 Fax:+86. Address of Shanghai Operation Center: Room 9 19, Xinye Building, No.388 Tianlin Road, Shanghai Postal Code: 200233 Tel: +86-2 1-54902 122 Mobile Phone: 1335662 1300 Fax. E-mail :market@kedasemi.com Shenzhen Sales Center? Address: 2 1 10 Yulong Garden, Shennan Avenue, Nanshan District, Shenzhen? Postal code: 5 18052? Tel: 0755-861916 Mobile:1333 29314961335 6621300? E-mail :market@kedasemi.com
Legal Representative: Liu Fengjie.
Date of establishment: 2007- 10-08
Registered capital: 50 million yuan.
Industrial and commercial registration number: 37050040000 1825
Type of enterprise: limited liability company (Sino-foreign joint venture)
Company Address: North of huanghe road and West of Planning Fifth Road, Dongying District, Dongying City, Shandong Province.