Xing sen technology, founded in 1999, is a listed company of Shenzhen Stock Exchange. Headquartered in Shenzhen, China, the company has established production and operation bases in Guangzhou, Yixing, Jiangsu and Britain. The company has branches in Beijing, Shanghai, Wuhan, Chengdu and Xi 'an, and subsidiaries in China, Hongkong and the United States. At present, dozens of customer service centers have been established at home and abroad, forming a global marketing and technical service network, providing quality services to more than 4,000 customers around the world.
Xing sen technology's future goal is to establish the world's largest rapid manufacturing platform in the field of PCB templates and multi-variety and small batch; Provide rapid proofing, mass production and manufacturing services for advanced IC packaging substrate products, and provide supporting technical services for IC industry chain; It will also build an open technical service platform, build a team of senior technical consultants and experts in the industry, form a comprehensive solution capability of common core technologies in the field of electronic hardware design, and provide customers with personalized one-stop services in combination with the ability to support multi-variety rapid mounting services.
Xing sen technology takes the mission of "assisting the continuous innovation of electronic technology", the vision of "becoming a world-class hardware solution provider" and the core values of "customer first, fast and efficient, continuous innovation and * * * common growth".