Because IGBT chips are usually large, the length will reach 10mm-20mm, while the size of DBC is usually 20 mm-40 mm. Such a large welding area makes it difficult for volatiles in welding materials to volatilize. Therefore, the porosity of IBGT welding layer has become a problem that people try their best to solve. For the requirements of high reliability IGBT, porosity must be an important control factor in the packaging process. Generally speaking, IGBT used in small household appliances and general electrical equipment requires a gap ratio.
Based on the research and development of semiconductor packaging materials, LED packaging materials and electronic assembly materials for more than ten years, Shenzhen Chenri Technology Co., Ltd. has developed MO3 and S03 (washed) IGBT lead-free solder paste, which can meet the requirements of low porosity and high reliability of IBGT packaging.