Shanghai Meiwei Technology Co., Ltd.-Semiconductor Packaging Substrate Technology Center came into being with the rapid development of semiconductor industry. As a member of TTM, we are committed to the research and development and production of packaging substrates, ball arrays and multi-chip products. With advanced production equipment, complete environmental protection facilities and professional talents, we will provide perfect services for chip packaging and flip chip industry.
The company is located in Songjiang Industrial Zone, Shanghai, near Shanghai Hongqiao Airport and Shanghai-Hangzhou Expressway, with convenient transportation.
"Comprehensive, thoughtful, timely, fast, sincere and trustworthy" is our unchanging customer service tenet.
"People-oriented" is the company's personnel philosophy. The company provides employees with a good working environment that can give full play to their personal abilities, and creates training opportunities for employees to explore their potential.
The company's training center has complete facilities, including library, football field, basketball court, billiards, table tennis and other sports facilities, corporate culture room (playing chess, reading books and watching TV), multi-function hall (karaoke, holding small parties) and other leisure and entertainment facilities. The company provides shuttle buses and free working meals, and the benefits are good.
Due to the development needs of the company, we are looking for all kinds of talents.
Company address: No.685, Yang Lian Road, Songjiang Industrial Zone, Shanghai.
Company mailbox :sp_hr@sp.ttmtech.com.cn.
Legal Representative: Bertcheva
Date of establishment: 1999-08-25
Registered capital: US$ 48 million.
Location: Shanghai.
Unified social credit code: 91310000607408619e.
Business status: survival (in business, in business, in registration)
Industry: manufacturing industry
Company type: limited liability company (wholly owned by Taiwan, Hong Kong and Macao)
English name: Shanghai Meadville Science &; Technology Co., Ltd
Number of employees: 1000-4999.
Address: 685 Yang Lian Road, Songjiang District, Shanghai.
Business scope: researching, designing and producing new chip electronic components, including high-density interconnection (HDI) printed boards, wafer substrates and related test instruments, selling self-produced products and providing related technical services; Lease some floors of its own factory building at No.685 Yang Lian Road, Songjiang Industrial Zone, Shanghai to affiliated enterprises of the same group. Projects that must be approved according to law can only carry out business activities after being approved by the relevant departments.