Main technology of electroless nickel and gold plating in circuit board processing

Pretreatment of 1 Ni-Au alloy

The equipment used is mainly plate mill or sandblasting machine or * * * machine type, and its main functions are:

Remove oxides and roughen the copper surface to increase the adhesion of nickel and gold.

Nickel-gold production line

Adopting vertical production line, the main process is as follows:

Plate feeding → degreasing → tertiary water washing → pickling → secondary water washing → micro-etching → secondary water washing → prepreg → activation → secondary water washing → electroless nickel plating → secondary water washing → chemical gold → gold recovery → secondary water washing → plate discharging.

(DZ-80X product of Guangdong Dazhi Environmental Protection Technology Co., Ltd. is recommended)

Nickel-gold post-treatment

The equipment used is mainly a horizontal cleaning machine (most of them use the brand universe).