Fang Jing technology
It is the first enterprise in China to engage in wafer-level chip packaging of image sensor chips (CCD and CMOS), and its wafer-level chip packaging technology is the only technology in the world that can be mass-produced in the application field of image sensor chips, accounting for more than 40% of the market share in this field. The company is funded by the most powerful venture capital institutions in Israel and China, and has a strong industrial background and financial strength. Suzhou factory was put into production in early February 2005.
Tongfu microelectronics
Nantong Fujitsu Microelectronics Co., Ltd. was established in Nantong, Jiangsu on February 4, 2007, 1994, and listed on Shenzhen Stock Exchange on August 6, 2007. It is a national and provincial high-tech enterprise famous for semiconductor research.
Huatian technology
On June 5438+065438+1October 12, 2003, Tianshui Huatian Microelectronics Co., Ltd., Gansu Electric Power Construction Investment and Development Company, Hangzhou Microelectronics Co., Ltd., natural persons Yang, Ge Zhigang, Shanghai Beiling Co., Ltd. and Wuxi Silicon Power Microelectronics Co., Ltd. signed the Sponsor Agreement, which was unanimous. On June 5438+February 65438+February 07, 2003, Gansu Provincial People's Government approved the establishment of Tianshui Huatian Technology Co., Ltd. with the document Han [2003] 146.