Gaoce Co., Ltd. is a research and development manufacturer of cutting equipment and cutting consumables for high-hardness brittle materials, and its products are mainly used for silicon wafer manufacturing in photovoltaic industry. Based on the core technology independently developed, the company continuously develops new products, and promotes the industrial application of diamond wire cutting technology in the processing of photovoltaic silicon materials, semiconductor silicon, sapphire materials, magnetic materials and other high-hardness and brittle materials. Help customers reduce production costs, improve production efficiency and improve product quality.
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