Since its establishment, Tongfu Microelectronics has been committed to improving the technical level and service quality, and has made remarkable achievements. At present, the company's products cover many types of integrated circuit packaging forms, including BGA, QFN, CSP and other high-end packaging technologies, as well as traditional SOP, DIP and other packaging forms. In addition, the company also provides wafer testing, finished product testing and other services to meet the diverse needs of customers.
In today's increasingly fierce market competition, Tongfu Microelectronics always adheres to technological innovation, constantly optimizes production technology and management processes, and improves production efficiency and product quality. At the same time, the company is also actively exploring new business areas, such as automotive electronics and Internet of Things. In order to maintain the sustainable development of enterprises.
In order to further expand its scale and enhance its competitiveness, Tongfu Microelectronics completed the acquisition of AMD Suzhou and Penang packaging and testing plants in 20 18, thus becoming the third largest independent packaging and testing service provider in the world. This major move not only enhanced the company's production capacity and technical strength, but also laid a solid foundation for future development.
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