Hayes of Huawei K3

The reporter learned that the department that produces K3 platform is called "Shenzhen Huawei Hisilicon Co., Ltd." and is currently a subsidiary of Huawei. Established in June 5438 +2004 10, the predecessor was Huawei integrated circuit design center established in June 5438 +099 1. Headquartered in Shenzhen, Hisilicon has design branches in Beijing, Shanghai, Silicon Valley and Sweden. Huawei Hisilicon products cover chips and solutions in the fields of wireless network, fixed network and digital media. In the field of digital media, it has introduced network monitoring chips and solutions, videophone chips and solutions, DVB chips and solutions and IPTV chips and solutions. According to Huawei Hisilicon, at present Hisilicon's business is mainly divided into two parts: one is to produce chips for Huawei's internal use; One is responsible for export, with a sales team of hundreds of people, producing set-top boxes and mobile phone chipsets. At first, Hisilicon's main product was WCDMA baseband chip. In 2006, Hisilicon began to invest in the research and development of smart phone platform AP, instead of simply producing baseband chips with phone function. Haisi's transformation has much to do with MediaTek's success. Gu Yong, vice president of Yulong Coolpad, told the reporter: "In layman's terms, the baseband chip is the processor responsible for handling the call function, and the AP is the processing of the multimedia part. Before MediaTek, the baseband chip and AP were completely separated, but MediaTek unified them. " MediaTek has seized the rapidly exploding low-end multimedia mobile phone market, and its baseband chip with integrated multimedia processor makes it unnecessary for mobile phone manufacturers to develop all aspects of mobile phone production. Soon, MediaTek's market share exceeded 50%. Not only TCL, Amoi and other brand mobile phone manufacturers have adopted the MediaTek scheme, but also mobile phone design companies such as Shanghai Wen Tai and CECW have adopted the MediaTek scheme. In 2006, Huawei Hisilicon, VIA, Sunplus and Mutual Core Integration began to join the field of mobile phone chip manufacturing. Initially, Huawei Hisilicon's main product was WCDMA baseband chip. After the MediaTek model was quickly welcomed by mobile phone manufacturers, Huawei Hisilicon began to concentrate on developing a chipset K3 with integrated multimedia functions. Since its birth, K3 has defined its future as a "low-cost entertainment smart phone platform". Huawei Hisilicon's plan follows closely the pace of 3G numbering in China. According to insiders of Huawei Hisilicon, "At present, K3 chips are mainly mobile edge products. It is expected that mass production of chips in CDMA 1x format will begin in May, and WCDMA products will be listed at the end of the year. "