The phrase "live quality" tells how unwilling Huawei is to the status quo. Is Huawei strong? Yes, the birth of Kirin and its shock to Kyushu are the best proof. There is only one obstacle in front of Huawei, and that is the OEM of chips. Recently, Huawei's chip production has turned around. Guo Ping, the rotating chairman of Huawei, officially announced the chip stacking technology.
So, what are the development advantages of Huawei's incoming chip stack? What are the benefits of the chip problem being solved for Huawei?
On March 28th, Huawei held the 20021annual press conference, and Guo Ping, the rotating chairman of Huawei, also attended. On that day, someone asked Huawei how to solve the problem of "stuck neck" in the future. In this regard, Guo Ping publicly responded that Huawei will invest in three reconstructions in the future, including the reconstruction of key development theories and the reconstruction of system architecture.
Does it feel professional? I didn't understand the meaning of this sentence. It's okay. Guo Ping explained the matter in detail. That is to say, exchange area for performance and stack for performance, so that Huawei's future products can be competitive without such advanced technology.
Personally, according to Guo Ping, the rotating chairman of Huawei, this may not be a 3D advanced package, but a simple dual-core superposition similar to a pyramid. Some people may also know that if such a simple dual-core superposition, even regardless of the size of the area, it may become the next Qualcomm fire dragon because of too much power consumption.
However, according to Huawei's practice, generally speaking, it will not be made public without complete success. Therefore, the practicality of Huawei's dual-core superposition still needs to be confirmed.
For this new news, many relevant foreign media have said that it is only a matter of time before Huawei's chip problem is overcome. So, is this really the case?
In fact, this is really the case, because Huawei's dual-core superposition is very likely to succeed. On May 18 last year, Huawei exposed a patent application, which is a chip superposition technology patent, and even attached a very credible dual-core superposition schematic diagram.
Huawei has such a technical foundation and such patents. It is not impossible to successfully launch a dual-core stacked chip in the future, and it is more likely to overcome the chip problem.
Moreover, dual-core superposition is a high-end technology, and high-end technology requires strong banknote-making ability. Also on March 28th, at the annual conference of Huawei 20021,Meng Wanzhou, vice chairman and CFO of Huawei, publicly announced Huawei's annual financial report. At present, Huawei's overall development situation is good, with a total revenue of 636.8 billion yuan last year.
The key point is that Huawei's R&D investment reached a new high last year, reaching 654.38+042.7 billion yuan, accounting for 22.4% of Huawei's total annual revenue. With such a large investment in scientific research, Huawei's dual-core superposition should probably be confiscated, and Huawei's chip problem should probably be overcome.
In short, the possibility of Huawei's dual-core superposition success is still very high. The foreign media is not mistaken, and the problem of Huawei chips is really just around the corner. In the future, Huawei chips may really hope to compete with Apple M 1 Ultra. Huawei's chip problem is just around the corner. So, what's good for Huawei?
Huawei's dual-core superposition, according to Huawei's own statement, is to realize two 14 nanometer chips and achieve the performance of 7 nanometer chips through superposition. It can also be said that the production of high-end chips can be achieved through chip stacking. So, did you find anything? You just need to use the low-end DUV mask aligner.
At the Shanghai World Expo on June 5438+065438+1October 5 last year, Shen Bo, vice president of Asmel, said that all types of mask aligner, including DUV mask aligner, except EUV mask aligner, can be shipped to China free of charge. In China, the research and development of Shanghai Microelectronics in domestic DUV mask aligner seems to be quite smooth, and it is not impossible for domestic low-end DUV to land in mask aligner in the future.
From these two things, we can easily find that once Huawei really realizes the dual-core superposition, and once Huawei really overcomes the chip problem, it can get rid of its dependence on advanced mask aligner, get rid of its dependence on the outside, and let the stuck neck officially become history.
In addition, once the problem of Huawei chips is solved, Huawei can develop and formally break through the process of high-end chips. In the future, Huawei will be able to enter the field of high-end chips. Although Huawei is only engaged in chip research and development, Huawei's dual-core superposition process and the entry of Huawei's high-end chips may not bring greater economic benefits to Huawei. With its ability to count banknotes, Huawei may not be able to realize the return of the king in advance.
Guo Ping, the rotating chairman of Huawei, officially announced that Huawei's high-end chip business is equivalent to finding a new direction, that is, chip stacking. Of course, we haven't seen the results of Huawei's dual-core superposition, but we believe in Huawei, believe in the light of domestic products, and believe in the concrete results of Huawei's dual-core superposition technology.
It should be on the market soon. In this way, Huawei may have to re-launch the banner of domestic products and re-shine the light of domestic products in the future.