Remarks:
Homology: Homology here refers to a new polyimide film.
This document is a patent application. When the new polyimide film is pressed on the material by a metal plate, its remarkable feature is that the thermal deformation can be significantly reduced. Therefore, the new polyimide film is also used in adhesive film and flexible metal-clad laminate, which can achieve the same effect of reducing thermal deformation.
For reference only.