The following aspects are introduced:
Electroplating gold application, electroplating gold process flow, electroplating gold principle, electroplating solution, electroplating equipment types, control of electroplating gold process parameters and performance of gold plating Performance.
Principle of electroplating gold
Gold-plated anodes generally use platinum titanium mesh materials.
When power is applied between the platinum titanium mesh (anode) and the silicon wafer (cathode), the solution will generate current and form an electric field. The anode undergoes an oxidation reaction to release electrons, while the cathode receives electrons and undergoes a reduction reaction.
The complexed gold ions near the cathode combine with electrons and are deposited on the surface of the silicon wafer in the form of gold atoms. Under the action of an external electric field, the complexed gold ions in the plating solution move directionally toward the cathode and supplement the concentration consumption near the cathode. This is a schematic diagram of horizontal cup plating, and Figure 2 is a schematic diagram of vertical rack plating.
The main purpose of electroplating is to deposit a dense, uniform layer of gold on the silicon wafer without holes, gaps, or other defects.