1, chromate-free, one-component, non-curing anti-corrosion sealant for aviation fuel.
2. A liquid epoxy resin composition for semiconductor packaging and its use.
3. Hot melt adhesive composition with excellent heat resistance and cold resistance
4. Adhesives for building structures
5. Powder crosslinkable fabric adhesive composition
6. Use of polymer dispersions as binders for sealing or coating compositions.
7. Composite epoxy resin
8. Preparation of resin emulsion for thick film cathodic electrophoretic coating
9, coloured glaze glass adhesive
10, aromatic amine epoxy curing agent and preparation method thereof
1 1. Liquid aromatic amine cured epoxy potting material and its preparation method.
12, instant plugging glue and its application method
13, cold curing epoxy resin formula
14. Improved method for preparing improved resin
15, photocurable adhesive
16, UV curable adhesive composition and products thereof
17, epoxy adhesive containing dithio ∴ amide adhesion promoter.
Preparation technology of 18 and hydroxypropyl starch with high degree of substitution
19, solvent-free epoxy-based adhesive for bonding semiconductor wafers and preparation method thereof.
20. An advanced heat-resistant and flame-retardant impregnating resin adhesive.
2 1, flame retardant thermoplastic resin composition
22. Bonding materials and reinforcement methods of bonded and anchored Baotou Steel
23. Polyurethane coatings and adhesives containing monoalkylated diene polymers and epoxidized derivatives thereof.
24. An anti-flow paste epoxy adhesive.
25. Adhesive composition and adhesive sheet
26. A curable organopolysiloxane composition with improved adhesion.
27, epoxy resin curing agent and its preparation method
28. Moisture-activated adhesive composition
29. Adhesives based on petrochemical reaction products.
30. High temperature resistant adhesive for flexible printed circuit and preparation method thereof
3 1, epoxy adhesive and copper foil, and laminates using them
32. Radiation Crosslinking and Subsequent Thermosetting Adhesives
33, high strength gypsum bonding powder
34, high strength, high toughness, high wear-resistant polyurethane-epoxy resin composite material preparation method.
35. Structural adhesive composition with high temperature resistance
36, amino multifunctional epoxy resin heat-resistant building structural adhesive
37. Methods to improve the performance of pressure-sensitive adhesives at temperatures below 0 F.
38, process papyrus polishing protective agent
39. Preparation method of bisphenol A epoxy acrylate diester
40. New two-component insulating adhesive.
4 1, preparation of phenolic epoxy resin by acetal method
42. Methods to enhance the adhesion of polyimide to active metals.
43, preparation of epoxy two-component transparent flexible packaging adhesive
44. Flour binder composition
45, one-component, non-flowing tough epoxy adhesive
46, a benzene-free, low toxicity epoxy paint thinner.
47, high temperature instant plugging glue and its preparation method
48. Low viscosity epoxy resin composition
49. Chemical modification process of sesbania gum and its products.
50. Photopolymerization composition with excellent adhesiveness, its products and preparation method.
5 1 room temperature curing high-temperature resistant high-strength toughness epoxy structural adhesive and preparation method thereof
52. Room temperature curing structural epoxy paste adhesive and its manufacturing method.
53, epoxy resin mixture
54. Used as a binder for cathodic electrolytic coating.
55. A solderable conductive composition with high adhesive strength.
56. Resin composition and method for manufacturing laminate using the same.