Wafer-level chip scale package technology
Wlcsp (wafer-level chip scale packaging) is a wafer-level chip packaging method, which is different from the traditional chip packaging method (cutting first and then packaging and testing, and increasing the volume of the original chip by at least 20% after packaging). This latest technology is to package and test the whole wafer before cutting it into individual IC particles, so the volume of the package is equivalent to the original size of the IC die. The packaging method of WLCSP not only significantly reduces the size of the storage module, but also meets the high-density requirements of mobile devices for the fuselage space; On the other hand, in terms of performance, it improves the speed and stability of data transmission.
Features and advantages of WLCSP
-Minimum package mode of original chip size:
The biggest feature of WLCSP wafer-level chip packaging method is to effectively reduce the packaging volume, so it can be matched with mobile devices and meet the characteristics of portable products.
-Short data transmission path and high stability;
When using WLCSP package, because the circuit wiring is short and thick (yellow lines are marked A to B), the frequency of data transmission can be effectively increased, the current consumption can be reduced, and the stability of data transmission can be improved.
Good heat dissipation characteristics
Due to the lack of traditional sealed plastic package or ceramic package, the heat energy of ic chip can be effectively dissipated without raising the main body temperature, which is of great help to the heat dissipation problem of mobile devices.