What are the requirements of flip chip COB for die bonder?

Some require not only more accurate bonding and larger substrate, but also complete bonding before solder paste deformation, with faster speed and higher chip bonding rate, which must be above 99.99%. I recommend a flip-chip die bonder, Zhuoxing Semiconductor. Their family has a very professional research on high-speed and high-precision chip bonding. The company has nearly 100 patents and software copyrights, and more than 20 invention patents. The precision and speed of flip chip bonder are very good.