SOT is a SOP package.
1. What is packaging?
Packaging means that the circuit pins on the silicon chip are led to external connectors through wires to connect with other devices. The packaging form refers to the shell in which the semiconductor integrated circuit chip is mounted. It not only plays the role of installing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, but also connects to the pins of the package shell through the contacts on the chip, and these pins are connected to other devices through the wires on the printed circuit board, thus realizing the connection between the internal chip and the external circuit. Because the chip must be isolated from the outside world, to prevent impurities in the air from corroding the chip circuit, resulting in the decline of electrical performance. On the other hand, the packaged chip is also more convenient to install and transport. Because the quality of packaging technology also directly affects the performance of the chip itself and the design and manufacture of the PCB (printed circuit board) connected to it, it is very important.
An important index to measure the advanced degree of a chip packaging technology is the ratio of chip area to packaging area. The closer this ratio is to 1, the better. Main factors to be considered when packaging:
1, the ratio of chip area to package area improves the package efficiency and is as close as possible to1:1;
2. Pins should be as short as possible to reduce delay, and the distance between pins should be as far as possible to ensure mutual interference and improve performance;
3. Based on the requirement of heat dissipation, the thinner the package, the better.
Packaging is mainly divided into two types: DIP dual in-line package and SMD patch package. Structurally, the package developed from the earliest transisTOr to (such as TO-89 and TO92) to dual in-line package, and then to SOP small outline package developed by PHILIP Company, and then SOJ(J-pin small outline package), TSOP (thin small outline package), VSOP (Minimal outline package), SSOP (miniature SOP) and TSSOP were gradually derived. In terms of materials and media, including metals, ceramics, plastics, etc., there are still a large number of metal packages for many high-strength circuits, such as military and aerospace.
Packaging has roughly experienced the following development process:
Structure: to-> dip->; PLCC->； QFP->； BGA-& gt； CSP
Material: metal, ceramic-> ceramic-> plastic; Plastic;
Pin shape: long pin insertion-> short pin or no pin installation-> spherical bump;
Assembly mode: through hole insertion-> curved surface assembly-> assembly; Direct loading
Second, the specific packaging form
1, SOP/SOIC package
SOP is the abbreviation of English Small Outline Package, that is, small outline package SOP packaging technology was successfully developed by Philips in 1968 ~ 1969, and then SOJ(J-pin small outline package), TSOP (thin small outline package), VSOP (very small outline package), SSOP (micro SOP), TSSOP (thin micro SOP) and SOT were gradually derived.
2.DIP package
DIP is the abbreviation of English Double In-line Package, namely dual in-line package. In one package, pins are led out from both sides of the package, and the packaging materials are plastic and ceramics. DIP is the most popular plug-in package, and its application scope includes standard logic ic, memory LSI, microcomputer circuit and so on.
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3.PLCC package
PLCC is the abbreviation of plastic led chip carrier, that is, plastic J-lead chip package. PLCC package mode, square in shape, 32-pin package, surrounded by pins, the overall size is much smaller than DIP package. PLCC packaging is suitable for SMT surface mount technology to install wiring on PCB, which has the advantages of small overall size and high reliability.
4.TQFP package
TQFP is the abbreviation of English thin quad flat package, that is, thin plastic quadrangular flat package. The square flat package (TQFP) process can effectively use space, thus reducing the requirements for the space size of printed circuit boards. Due to the reduced height and volume, this packaging process is very suitable for applications with high space requirements, such as PCMCIA cards and network equipment. Almost all ALTERA CPLD/FPGA have TQFP package.
5.PQFP package
PQFP is the abbreviation of plastic square flat package, that is, plastic square flat package. The pin spacing of PQFP package is very small and the pins are very thin. Generally, large-scale or very large-scale integrated circuits adopt this packaging form, and the number of pins is generally above 100.
6.TSOP package
TSOP is the abbreviation of English Thin Small Outline Package, that is, thin small size packaging. The typical feature of TSOP memory packaging technology is to manufacture pins around the packaging chip. TSOP is suitable for mounting wiring on PCB (printed circuit board) by SMT technology (surface mounting technology). When the TSOP package is in the overall size, the parasitic parameters (which will cause output voltage disturbance when the current changes greatly) are reduced, which is suitable for high-frequency applications, convenient to operate and high in reliability.
7.BGA package
BGA is the abbreviation of English Ball Grid Array Package, namely ball grid array package. In the 1990s, with the development of technology, the integration of chips has been continuously improved, the number of I/O pins has increased dramatically, and the power consumption has also increased, so the requirements for integrated circuit packaging have become more stringent. In order to meet the needs of development, BGA packaging has been applied to production.
The memory encapsulated by BGA technology can increase the storage capacity by 2 to 3 times without changing the volume. Compared with TSOP, BGA has smaller volume, better heat dissipation performance and electrical performance. BGA packaging technology greatly improves the storage capacity per square inch, and the memory products using BGA packaging technology are only one-third of TSOP packaging at the same capacity. In addition, compared with the traditional TSOP packaging method, BGA packaging method has a faster and more effective heat dissipation method.
I/O terminals of BGA package are distributed under the package in the form of circular or columnar solder joints in the array. The advantage of BGA technology is that although the number of I/O pins has increased, the pin spacing has not decreased, thus improving the assembly yield. Although the power consumption is increased, BGA can be welded by controlled chipping method to improve its electrothermal performance. The thickness and weight are lower than those of the previous packaging technology; The parasitic parameters are reduced, the signal transmission delay is small, and the use frequency is greatly improved; * * * It can be assembled by surface welding with high reliability.
When it comes to BGA packaging, we can't help but mention Kingmax's patented TinyBGA technology. TinyBGA is called Tiny Ball Grid Array in English, which belongs to a branch of BGA packaging technology. Developed by Kingmax company in August 1998. The ratio of chip area to package area is not less than 1: 1. 14, and the storage capacity can be increased by 2-3 times under the condition of constant volume. Compared with TSOP packaging products, it has smaller volume and better heat dissipation and electrical performance.
The memory products with TinyBGA packaging technology are only 1/3 of TSOP packaging at the same capacity. The pins of TSOP package memory are led out from the periphery of the chip, while TinyBGA is led out from the center of the chip.
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Get out. This method effectively shortens the signal transmission distance, and the length of the signal transmission line is only 1/4 of that of the traditional TSOP technology, so the signal attenuation is also reduced. This not only greatly improves the anti-interference and anti-noise performance of the chip, but also improves the electrical performance. TinyBGA packaging chip can resist external frequency as high as 300MHz, while traditional TSOP packaging technology can only resist external frequency as high as 150MHz.
TinyBGA memory is thinner (the packaging height is less than 0.8mm), and the effective heat dissipation path from the metal substrate to the radiator is only 0.36 mm ... Therefore, TinyBGA memory has higher heat conduction efficiency, which is very suitable for long-term running systems and has excellent stability.
Three, some international brand product packaging naming rules information
1, please consult www.maxim-ic.com for more information.
Maxim is prefixed with "MAX". Dallas begins with "DS"
Maximum or maximum, maximum, maximum, maximum, maximum, maximum, maximum, maximum, maximum, maximum.
Description:
1, suffix CSA, CWA, where C stands for ordinary level, S stands for curved surface sticker, and W stands for wide-body curved surface sticker.
2. Suffix CWI means wide-body surface sticker, EEWI wide-body industrial-grade surface sticker, and suffix MJA or 883 is military-grade.
3. The suffixes CPA, BCPI, BCPP, CPP, CCPP, CPE, CPD and ACPA are all common double spelling.
For example, MAX202CPE, CPE common ECPE common belt anti-static protection.
MAX202EEPE industrial-grade anti-static protection (-45℃-85℃), indicating that E refers to the MAXIM digital arrangement classification of anti-static protection.
1 prefix simulator 2 prefix filter 3 prefix multiplexing switch
4 Prefix Amplifier 5 Prefix DAC 6 Prefix Voltage Reference
7-prefix voltage conversion 8-prefix reset 9-prefix comparator
Dallas naming rules
For example, ds1210n.s.ds1225 y-100ind.
N= industrial grade S= surface mount wide body MCG=DIP sealing Z= surface mount wide body MNG=DIP industrial grade.
IND= industrial QCG=PLCC seal Q=QFP
2. For more information about ADI, please visit www.analog.com.
Advertising products are mostly "AD" and "ADV", and some begin with "OP" or "REF", "AMP", "SMP", "SSM", "TMP" and "TMS".
Suffix description:
1, where j stands for civil products (0-70℃), n stands for ordinary plastic packaging, and r in the suffix stands for surface sticker.
2. Suffix with D or Q indicates ceramic seal, industrial grade (45℃-85℃). H in the suffix stands for round hat.
3. SD or 883 in the suffix belongs to military products.
For example: JN DIP package JR face-mounted JD DIP ceramic seal.
3.BB See www.ti.com for more information.
BB product naming rules:
The prefix ADS Analog Device suffix U Surface Mount P is Dip Package Band B stands for industrial prefixes INA, XTR, PGA, etc. It stands for high-precision operational amplifier suffix U surface mount P stands for DIP PA.
4. For more information about Intel, please visit www.intel.com.
Intel product naming rules:
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N80C 196 series are all single-chip computers.
Prefix: N=PLCC package T= industrial grade S=TQFP package P=DIP package
KC20 frequency KB frequency MC represents 84 advance angles.
For example: te28f640J3A-120 flashte = tsopda = ssop e = tsop.
5. See www.issi.com for more information about ISSI.
Start with "yes"
For example, is 6 1 cis 6 1 LV 4x stands for dram, SRAM stands for EEPROM.
Packing: PL=PLCC PQ=PQFP T=TSOP TQ=TQFP
6. Linearity See www.linear-tech.com for more information.
Prefix with product name
LTC 105 1SCS stands for surface sticker.
LTC 105 1CN8 ** stands for *IP package with 8 pins.
7. For more information, please refer to www.idt.com IDT.
IDT products generally start with IDT.
Suffix description:
1, and TP in the suffix belongs to narrow dip.
2. the p in the suffix belongs to wide-body DIP.
3. The j in the suffix belongs to PLCC.
For example, IDT 7134S55p is the DIP package.
IDT7 132SA55J is PLCC.
IDT7206L25TP is DIP.
8. See www.national.com for more information.
The product part of NS begins with LM and LF.
LM324N 3 prefix stands for the civilian products of n round hats
The prefix LM224N 2 stands for industrial grade J-belt ceramic seal.
The prefix LM 124J 1 stands for N plastic-sealed military products.
9.HYNIX See www.hynix.com for more information.
Package: DP stands for DIP package, DG stands for SOP package and DT stands for TSOP package.
TO-220 package is usually 3 pins, which is one of the most common packages.
Two pins are generally a diode, and two diodes are packaged together to form three pins.
More than four pins are basically integrated circuits.
This kind of package will have a bare metal sheet on one side, which is used to directly connect with the radiator and has good heat dissipation effect. Although the specific heat resistance is larger than TO-3, the installation and connection are very simple, which is the most common in in-line packaging. However, because the metal heat dissipation part of this package is directly connected with the pin, it is more troublesome to insulate it from the external radiator. Not only insulating gaskets such as mica sheets, but also insulating sleeves should be added.