At the recent Huawei 2021 annual report conference, Huawei’s rotating chairman Guo Ping gave the answer.
Guo Ping said that exchanging area for performance and stacking for performance will enable Huawei to remain competitive in future products even with less advanced processes.
This is the first time Huawei has publicly confirmed chip stacking technology. In other words, higher performance can be obtained by increasing the area and stacking, so that low-process manufacturing processes can catch up with the competitiveness of high-performance chips.
According to past experience, Huawei has often verified its feasibility when it announces a technology. This also means that Huawei’s chips using chip stacking technology are likely to be available in the near future.
Of course, after improving the performance of low-process chips through stacking technology, we still have to face a very real problem. For example, when the size becomes larger, the resulting increase in power consumption and heat will also increase.
If it is used as a mobile phone SoC, there are still many problems that need to be solved such as the internal space, structural design, battery capacity and other limitations of the mobile phone.
But no matter what, this statement has proved that Huawei already has clear goals and strategies in the chip field.
As for when it will be implemented, can it be applied to mobile phone SoC chips, and will a new generation of Kirin chips arrive? Just give it time, I think we should trust Huawei.