Semiconductor subdivision field
Design tool
EDA software
Semiconductor design: Minde Electronics, Obit (IC design), Cambrian (SOC chip design), Gekewei, Huawei Microelectronics, Lihewei (former chip design factory).
Chip design
Integrated circuits include memory chips (NANDFlash, NORFlash, DRAM), CPU, GPU, MCU, FPGA, DSP, touch and fingerprint identification chips, RF front-end chips and analog chips.
Memory chips: Zhao Yi Innovation, Beijing Zheng Jun, Guo Kewei and Novo Fleisch.
CPU (Central Processing Unit):, Zhongke Shuguang, Changdian Technology
GPU (Graphics Processor): Jing Jiawei
MCU: Zhao Yi Innovation, Fumanwei, Xinhai Technology, *ST Datang, Lihewei.
FPGA (semi-custom circuit chip): Ziguang Guowei, Fudan Microelectronics, Anlu Technology.
DSP (Digital Signal Processor): Guo Rui Science and Technology, Sichuang Electronics and Lihewei.
Touch and fingerprint identification chip: Ding Hui technology, Zhao Yi innovation.
RF front-end chips: Zhuo Shengwei, Sanan Optoelectronics, Fumanwei, Rowen (6-inch GaAs microwave RF chip), Ivy Electronics.
Analog chips: Sheng Bang, Weir, Technology, Beijing Zheng Jun, Xinhai Technology (analog signal chain), Yaguang Technology (Sun Ruixin is an analog chip research and development manufacturer), and Electronics.
Digital chips: Chen Jing, Lexin Technology, Ruixinwei and Quanzhi Technology.
Power chips: Starr Semiconductor, Jiejie Microelectronics, Jingfeng Mingyuan.
WiFi Chip: Integration of Huasheng Tiancheng and Broadcom
2. Photoelectric equipment
LED: Sanan Optoelectronics (involving epitaxial wafers and chips of new semiconductor materials such as gallium arsenide, gallium nitride, silicon carbide, indium phosphide, aluminum nitride and sapphire), Zhouming Technology, Huacan Optoelectronics (LED epitaxial wafers and full-color LED chips), Jucan Optoelectronics (GaN-based high-brightness LED epitaxial wafers and chips), dry photons (full-color LED epitaxial wafers and chips) and Liard.
Mini led: BOE a, TCL
3. Discrete devices include IGBT, MOSFET, power diode, thyristor, crystal oscillator and capacitive resistor.
IGBT: Starr Semiconductor, Times Electric, Taiji, Silanwei, Yangjie Technology, Ziguang Guowei, Huawei Microelectronics and Xinjieneng.
MOSFET: China Resources Micro, Silanwei, Fumanwei, Lyon Micro, Yangjie Technology, Yinhe Micro-Power, Jiejie Micro-Power, Suzhou Solid Technetium and Xinjieneng.
Power diodes: Yang Jie Technology, Taiji (rectifier tube), Silanwei (fast recovery diode FRD, transient suppression diode TVS, light-emitting diode), Galaxy Microelectronics, Huawei Microelectronics, Suzhou Solid Technetium.
Thyristors: J.J. Microelectronics, Taiji, J.J. Microelectronics, Perry (crystal gate for high voltage DC valve)
Jingzhen: Taijing Technology
Capacitance and Resistance: Fenghua Hi-Tech
4. Sensor
Minxin Co., Ltd. (MEMS sensor), China Resources Micro (intelligent sensor), Silanwei (MEMS sensor) and Guangpu Co., Ltd. (semiconductor photoelectric sensor)
OEM manufacturing
Wafer processing: SMIC
Open wafer manufacturing: China Resources Micro
MEMS wafer manufacturing: sai microelectronics
Packaging test
Changdian Technology, Tongfu Microelectronics, Huatian Technology, Fang Jing Technology, Kangqiang Electronics, China Resources Micro, Dagang, Qiwei Technology, Huawei Microelectronics, xing sen technology (Semiconductor Test Board), Suzhou Gugong.
Wafer manufacturing material
Silicon wafer: Shanghai Silicon Industry, Zhonghuan Co., Ltd., Leonway (semiconductor silicon wafer), Shen Gong Co., Ltd. (monocrystalline silicon material), Zhongjing Technology.
Photoresist: Nanda Optoelectronics, Rong Da Photosensitive, Feikai Materials, Jing Rui, Jacques Technology, Antai Technology.
Special gas: Walter gas, Jacques technology
Wet electronic chemicals: Jiang Huawei
Target: Jiangfeng Electronics, Longhua Technology, Youyan New Materials, Ashichuang (sputtering target), Jiangfeng Electronics (high purity sputtering target).
CMP polishing materials: Anji Technology and Dinglong.
High purity reagents: Shanghai Xinyang, Jing Rui,
Third generation semiconductor
Gallium nitride GaN: Fuman Electronics, Aohai Technology (gallium nitride charger), Jucan Optoelectronics (GaN-based high-brightness LED epitaxial wafer and chip), Wen Tai Science and Technology, Saimicroelectronics [6-8 inch silicon-based gallium nitride (GaN-on-Si), silicon carbide-based gallium nitride (GaN-on-SiC)], Haineng Industry (fast-charging gallium nitride products), Zhao Chi shares [trillion
Silicon carbide Sic: Lu Xiao Science and Technology (silicon carbide substrate and epitaxial wafer), Chujiang New Materials, Wen Tai Science and Technology, Tianfu Energy (silicon carbide substrate link, Tian Kehe Da shares), Sanan Optoelectronics (epitaxial wafer and chip involving new compound semiconductor materials such as arsenide, nitride, phosphide and silicon carbide), Times Electric, Jiejie Microelectronics, Wenzhou Hongfeng (silicon carbide single crystal research and development), Ziguang Guowei.
equipment
Mask aligner:
Etching machine: Zhongwei Company (Plasma Etching Equipment, CPP, ICP), Xinyuanwei (Wet etching machine), North Huachuang.
Ion implantation equipment: Ye Wan enterprises.
Furnace tube equipment: North Huachuang, Jingsheng electromechanical.
Cleaning equipment: North Huachuang, Zhichun Technology (research and development of semiconductor wet cleaning equipment), Xinyuanwei.
Testing equipment: Precision Measurement Electronics, Huafeng Measurement and Control, Changchuan Technology.
Physical vapor deposition equipment PVD: North Huachuang and Huaya Intelligent (structural parts in the field of semiconductor equipment)
Chemical vapor deposition equipment CVD: North Huachuang, Jingsheng Electromechanical, Huaya Intelligent (structural parts in the field of semiconductor equipment)
Glue coating/developing machine: core source micro
Glue spraying machine: core source micro
Atomic layer deposition equipment ALD: North Huachuang
MOCVD equipment: Zhongwei Company
Semiconductor micro-assembly equipment: Yi Tian.
other
Huawei Hisilicon Supplier: Mingpu Optics and Magnetics
Mask: Qingyi Photoelectricity
PVD coating: Ashtron
Painting equipment: Ba Li (Tuojing Technology)
Printed circuit board PCB: Aohong Electronics, Concord Electronics, Huazheng New Materials [copper clad laminate], xing sen technology, Jinan Jiguo, Xunjixing, Benchuan Intelligent, Hong Sheng Science and Technology, Sihui Fuji, Ultrasonic Electronics, Aoshikang, Hudian, Yangming Circuit and Yuejunya.
Thermal field system of single crystal furnace: Jinbo Co., Ltd.
Industrial Vision Equipment: Tianzhun Technology
Timely Crystal: Huilun Crystal, Oriental Crystal Electronics.
Capacitors: Jianghai, Aihua Group and Tongfeng Electronics.
FPC board: Fenghua Hi-Tech, *ST Danbang