I just checked the patent. High strain point glass involves a glass substrate composition, which contains SiO2 55~70wt%, Al2O30~1wt%, ZrO2 0.1~5wt%, Na2O 0.1~5wt%, K2O 7～13wt%, MgO7～14wt%, CaO 0～4wt%, SrO 7～12wt% and SO3 0.01～0.5wt%.
The glass substrate prepared by using the above composition shows low thermal deformation during firing at high temperatures due to its strain point of at least 570°C, without e.g. fuel due to the melting point below 1460°C It has the disadvantages of increased cost and short life cycle of refractory materials, and has a thermal expansion coefficient of 80~95×10-7/℃ in the temperature range of 50~350℃.
Therefore, the glass according to the invention is suitable for use as a substrate.
Substrate is the basic material for manufacturing PCB. Generally, the substrate is copper-clad laminate. Single- and double-sided printed boards are manufactured using the substrate material - copper-clad laminate (Copper- (2lad I.aminates, CCI.), hole processing, chemical copper plating, electroplating copper plating, etching and other processes are selectively performed to obtain the required circuit pattern.
Another type of multi-layer printed board. The manufacturing method also uses the core thin copper-clad foil board as the base, and alternately laminates the conductive pattern layer and the prepreg sheet (Pregpr'eg) together at one time to form more than three layers of conductive pattern layer interconnection. The three functions of conductivity, insulation and support. The performance, quality, processability in manufacturing, manufacturing cost, manufacturing level, etc., largely depend on the substrate material.