At present, chemical mechanical polishing (CMP) technology is widely used to polish silicon wafers with SiO2 _ 2 polishing solution. There are rough polishing and fine polishing in the polishing process, so there are rough polishing solution and fine polishing solution. It is predicted that during the period of 2005 -20 10, the overall demand for polishing liquid in China semiconductor polishing wafer industry will increase at an average annual rate of 25%. In 2004, the total consumption of colloidal silica slurry was about 157 tons. The crude liquid is about 126 tons, and the fine liquid is about 3 1.5 tons.
At present, most of the polishing solutions used in the processing of semiconductor silicon polishing wafers in China are imported. The foreign manufacturers with high market share of semiconductor silicon polishing solution mainly include Rodel &; Onden Nalco in the United States, DuPont, and FUJIMI in Japan. Although there are dozens of enterprises in the domestic polishing solution industry, few enterprises really set foot in the manufacturing and research and development of semiconductor wafer polishing solution. Regardless of product quality or market share, domestic enterprises have shown a considerable gap with foreign manufacturers.