Thermal conductive silica gel: Thermal conductive silica gel is a kind of adhesive with high thermal conductivity, which is mainly composed of silica gel and thermal conductive filler. It has the following advantages:
High thermal conductivity: Thermal conductive silica gel has high thermal conductivity and can effectively transfer the heat generated by the chip.
Good flexibility: Thermal conductive silica gel has good flexibility and filling performance, and can adapt to the gap between irregular chips and heat sinks.
Easy to construct: Thermal conductive silica gel is easy to construct and operate, and can be coated between the chip and the radiator manually or automatically.
High thermal conductivity insulating alumina ceramics: High thermal conductivity insulating alumina ceramics is a kind of ceramic material with excellent thermal conductivity and insulating properties, which is suitable for heat dissipation applications. It has the following advantages:
High thermal conductivity: High thermal conductivity insulating alumina ceramics have high thermal conductivity, which can effectively transfer heat and optimize the heat dissipation effect of the chip.
Good insulation: High thermal conductivity insulating alumina ceramics have excellent insulation performance, which can provide electrical isolation and safety protection.
High temperature resistance: high thermal conductivity insulating alumina ceramics can maintain stable performance in high temperature environment, which is suitable for applications that need high temperature heat dissipation.
When selecting thermal conductive materials, it is necessary to comprehensively consider the heat dissipation requirements, working temperature, material availability and cost of the chip. For smaller chips or general heat dissipation requirements, thermally conductive silica gel may be an economical and practical choice. For high-power chips or temperature-sensitive applications, high thermal conductivity insulating alumina ceramics may be more suitable, which can provide better heat dissipation and insulation performance.
Finally, it is suggested that comprehensive evaluation and testing should be carried out according to the specific application requirements and design conditions, and the most suitable heat dissipation materials should be selected.