This technology is applied to laser rapid activation metallization technology (Laser ActivationMetallization, referred to as LAM technology) of ceramic microwave components. The advantage is that the bonding strength between the metal layer and the ceramic is high, the conductivity is good, and it can be used multiple times For welding, the metal layer thickness is adjustable within 1μm-1mm, the L/S resolution can reach up to 10μm, and via-hole connections can be directly realized easily. This technology has obtained a national invention patent, and Sri Lanka uses LAM technology.
Laser equipment of this technology can also be used for:
1. A variety of ceramic substrates (aluminum oxide, aluminum nitride, zirconium oxide, magnesium oxide, beryllium oxide) and thick Precision micro-machining of thin film circuit substrates, LTCC, HTCC, green ceramic tapes, micro integrated circuits, microwave circuits, antenna templates, filters, passive integrated devices and other various semiconductor materials. Precision cutting, scribing and drilling of various substrates such as DPC, COB and transparent ceramics in the high-power LED industry.
2. Laser is suitable for processing various types of PCB materials, such as: FR4 type copper clad board, PET film coated with aluminum metal layer, ceramics, microwave substrate TMM, Duorid and PTFE. When processing flexible substrates and sensitive substrates, laser direct structuring technology has more obvious advantages. Photoetching can be performed without contact with the material, so it is more reliable and will not cause damage to the substrate. The laser directly peels off the copper layer over a large area without damaging the base material (both soft and hard bases can be used)