No right-deemed to have been withdrawn
ApplicationNo.: 98 108800.7 Application Date: 1998-04-29.
Abstract: A packaged integrated circuit device comprises a substrate with a first surface and a second surface opposite to the first surface, wherein signal patterns and electrical contacts are formed on the first surface, and the substrate has at least one through slot. An integrated circuit chip is fixed on the second surface of the substrate, and the integrated circuit chip has a first surface on which active regions and pads are formed and a second surface opposite to the first surface and exposed to the outside of the package. The bonding wire is used to electrically connect the signal pattern of the substrate to the bonding pad through the through slit. According to the capillary phenomenon, the active area and bonding wire of the chip are sealed with the injected unsatisfied solution.
Applicant: Modern Electronics Industry Co., Ltd.
Inventor (Designer): Kong
Main classification number: H0 1L23/ 12.
Classification number: H0 1L23/ 12.